Semiconductor Package Clip Structure for Fixed Footprint Cooling
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Solution Overview
Problem
Conventional semiconductor packages face challenges in accommodating semiconductor devices of varying lateral sizes without altering the package footprint, and they often require complex molding materials that can hinder heat dissipation and reliability.
Innovation Solution
The semiconductor package design incorporates a redistribution substrate with solderable contact pads and a contact clip that includes a web portion and peripheral rim portions, allowing for flexible placement of electrodes and independent internal connections, eliminating the need for molding material and enhancing heat dissipation through exposed metal surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional molding materials are used to cover the semiconductor device, then the package is protected and sealed, but heat dissipation is hindered and reliability is reduced
Solution Approach 1:
The patent removes the traditional molding material that covers the semiconductor device and exposes the metal electrodes and contact pads. This extraction eliminates the thermal barrier created by molding compounds, allowing direct heat dissipation from the semiconductor device to the package exterior through the metal components, while maintaining package integrity through the redistribution substrate and contact clip structure
Solution Approach 2:
The patent employs a redistribution substrate with a metallization layer that provides both electrical connection and thermal management functions. The metallization layer acts as a heat spreader and dissipation path, replacing the solid molding material with a structure that allows thermal energy to conduct and radiate more effectively from the device
2Manufacturing precision
If the package footprint is fixed, then manufacturing consistency is improved, but accommodating semiconductor devices of varying lateral sizes becomes difficult
Solution Approach 1:
The patent uses a redistribution substrate that redistributes electrical connections in a planar dimension, allowing the semiconductor device to be mounted with its electrodes facing upward. This dimensional reorganization enables devices of different lateral sizes to be accommodated on the same footprint by flexing the interconnection paths on the substrate plane rather than requiring vertical space variations
Solution Approach 2:
The contact clip serves multiple functions: it provides electrical connection between the semiconductor device electrodes and the package external contacts, mechanically secures the device to the redistribution substrate, and enables thermal management. This multi-functionality allows a single standardized package structure to accommodate various device sizes and types
3Reliability
If complex molding materials and processes are used, then package sealing and protection are achieved, but manufacturing complexity and costs increase
Solution Approach 1:
The patent eliminates the molding compound material and associated injection molding process from the package structure. By removing this complex material system, the manufacturing process is simplified while the sealing and protection functions are maintained through the redistribution substrate and contact clip assembly, reducing both manufacturing complexity and cost
Solution Approach 2:
The patent changes the material parameters from organic molding compounds to inorganic/metallized components (redistribution substrate with metallization layer and contact clip). This parameter change enables alternative sealing and protection mechanisms that are achieved through precise metallization and mechanical assembly rather than through complex polymer processing
Data Source
AI summary
A method includes: arranging a semiconductor device on a redistribution substrate, the device having a first power electrode and a control electrode on a first surface and a second power electrode on a second surface, the redistribution substrate having an insulating board having a first major surface and a second major surface having solderable contact pads, so that the first power electrode is arranged on a first conductive pad and the control electrode is arranged on a second conductive pad on the first major surface; arranging a contact clip such that a web portion is arranged on the second power electrode and a peripheral rim portion is arranged on a third conductive pad on the first major surface; and electrically coupling the first power electrode, control electrode and peripheral rim portion to the respective conductive pads and electrically coupling the web portion to the second power electrode.