Semiconductor Package Attachment Clips for Heat Transfer
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Solution Overview
Problem
Existing semiconductor packages often lack a suitable attachment mechanism, resulting in poor contact and reduced heat transfer between the package and the carrier, such as a printed circuit board or ceramic carrier.
Innovation Solution
A semiconductor package design featuring a housing with angled projections and attachment clips that extend between sides, allowing for improved contact and heat transfer, with clips that can bend to apply a uniform force and include loops for flexibility, facilitating secure attachment to a carrier.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional attachment mechanisms are used, then the package structure is simple, but the contact between package and carrier is poor and heat transfer is reduced
Solution Approach 1:
The package structure is divided into multiple functional segments: a housing containing semiconductor die, angled projections extending from the housing, and attachment clips that can bend independently. This segmentation allows each component to perform its specific function optimally while maintaining overall structural integrity.
Solution Approach 2:
The attachment clips are designed to be flexible and bendable, allowing them to dynamically adjust during the attachment process. The clips can bend to apply uniform force across the carrier surface, ensuring reliable contact and heat transfer while accommodating variations in carrier flatness.
2Force
If rigid attachment structures are used, then the attachment force is strong, but the force distribution is uneven and contact is poor
Solution Approach 1:
The attachment clips are designed with flexibility to dynamically adjust their position and apply force uniformly across the carrier surface. This dynamic capability ensures that the attachment force is distributed evenly rather than concentrated at single points.
Solution Approach 2:
The clips can change their physical state from unbent to bent, altering their geometry to optimize force distribution. This parameter change allows the same component to provide both strong attachment force and uniform force distribution.
3Temperature
If no attachment mechanism is used, then the package structure is simple, but heat transfer between package and carrier is reduced
Solution Approach 1:
The attachment clips serve multiple functions simultaneously: they provide mechanical attachment to secure the package to the carrier, distribute force uniformly to ensure good contact, and facilitate heat transfer by maintaining consistent thermal contact between the package and carrier surfaces.
Solution Approach 2:
The attachment mechanism is integrated with the housing structure through angled projections, combining the housing and attachment components into a unified structure. This merging reduces overall complexity while achieving both attachment and heat transfer functions.
Data Source
AI summary
In one embodiment, a semiconductor package may be formed having a first side and a second side that is substantially opposite to the first side. An embodiment may include forming an attachment clip extending substantially laterally between the first and second sides wherein the attachment clip is positioned near a distal end of the first and second sides. An embodiment may also include forming the attachment clip to have a flexible main portion that can bend away from a plane of the main portion toward a bottom side of the semiconductor package.