Semiconductor Package Clip Heat Sink Dual Dissipation
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Solution Overview
Problem
Conventional semiconductor packages face challenges in heat dissipation, cost-effectiveness, and reliability due to manufacturing complexities and non-standardized designs, particularly in dissipating heat from both upper and lower surfaces, which affects the performance and efficiency of semiconductor devices.
Innovation Solution
A semiconductor die package design featuring a clip structure attached to the upper surface of the die with a heat sink exposed through the molding material, allowing for dual heat dissipation from both the top and bottom surfaces, utilizing a copper heat sink and lead frame for enhanced thermal conductivity and simplified manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional QFN packages dissipate heat only from the bottom surface, then manufacturing is simpler, but heat dissipation performance is insufficient
Solution Approach 1:
The heat dissipation function is segmented into two independent paths: bottom surface heat dissipation through the lead frame and top surface heat dissipation through the exposed heat sink. This segmentation allows each surface to independently contribute to thermal management, resolving the contradiction by enabling dual heat dissipation without requiring a complete redesign of the package structure.
Solution Approach 2:
The invention transitions from single-surface (bottom-only) heat dissipation to dual-surface (top and bottom) heat dissipation by adding a vertical dimension to the heat dissipation pathway. The heat sink extends upward from the die through the molding compound, creating a three-dimensional heat dissipation architecture that improves thermal performance without planar complexity.
2Manufacturing precision
If custom trimming and forming machinery is used for lead configuration, then lead shape precision is improved, but production cost and complexity increase
Solution Approach 1:
The lead frame is pre-configured with the desired lead configurations during the stamping process before assembly. This preliminary action eliminates the need for subsequent custom trimming and forming operations, maintaining manufacturing precision while significantly reducing production complexity and cost.
Solution Approach 2:
The invention extracts the lead forming operation from the assembly process by incorporating pre-formed leads into the lead frame design. This separation of the forming operation from the assembly process eliminates the need for specialized post-assembly forming machinery and reduces overall manufacturing complexity.
3Reliability
If wire bonding and solder/epoxy die attachment are used, then electrical connection reliability is improved, but production time and complexity increase
Solution Approach 1:
The invention merges the die attachment and electrical connection functions into a single clip structure that provides both mechanical support and electrical connectivity. This consolidation eliminates separate wire bonding and solder/epoxy attachment steps, reducing production time and complexity while maintaining reliable electrical connections through the clip's direct contact with the die.
4Temperature
If dual heat dissipation is implemented, then thermal performance is improved, but manufacturing challenges and alignment consistency worsen
Solution Approach 1:
The heat sink serves multiple functions: it provides top surface heat dissipation, acts as a mechanical support structure for the die, and serves as a reference feature for alignment during assembly. This multi-functionality reduces the number of separate components and alignment requirements, improving manufacturing consistency while maintaining dual heat dissipation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively dissipates heat from both surfaces, improving the reliability and cost-effectiveness of semiconductor packages by maintaining standard tooling compatibility and allowing for flexible use with various package formats and die sizes, while providing additional moisture protection and reduced production complexity.
Implementation Method 1
a heat sink attached to an upper surface of the clip structure
Implementation Method 2
dissipate heat from the exposed surface of the lead frame at the bottom of the package
Data Source
AI summary
A semiconductor die package includes: an assembly including a semiconductor die, a clip structure attached to an upper surface of the semiconductor die, and a heat sink attached to an upper surface of the clip structure; and a molding material partially encapsulating the assembly, wherein an upper surface of the heat sink is exposed through the molding material.