Semiconductor Package Clip Structure Without Wirebonds
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Solution Overview
Problem
Existing semiconductor packages face challenges in efficiently interconnecting components without wirebonds, particularly in high-power applications, which can lead to damage and reduced reliability.
Innovation Solution
The implementation of clips and electrically conductive spacers that are coupled over a substrate, providing vertical connections and eliminating the need for wirebonds, along with the use of sintering materials like silver sintering for bonding, enhances electrical and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wirebonds are used to interconnect components in semiconductor packages, then electrical connections can be established, but the risk of damage increases and reliability decreases in high-power applications
Solution Approach 1:
The patent removes wirebonds from the interconnection system entirely, extracting the problematic element that causes damage in high-power applications. Instead of using wirebonds, the invention employs direct bonding methods where die are bonded directly to the substrate using sintering materials, eliminating the wirebond interface that is susceptible to damage.
Solution Approach 2:
The patent replaces the mechanical wirebond system with a direct bonding approach using sintering materials. This substitution eliminates the mechanical wirebond structure that is vulnerable to high-power conditions and replaces it with a more robust direct connection method that bonds die directly to the substrate through controlled sintering processes.
2Temperature
If wirebonds are used for interconnection, then electrical connections are established, but thermal performance deteriorates
Solution Approach 1:
The patent extracts wirebonds from the thermal conduction path, removing the thermal resistance they introduce. By eliminating wirebonds and implementing direct bonding of die to substrate, the thermal path is shortened and optimized, allowing more efficient heat dissipation from the die to the substrate.
Solution Approach 2:
The patent replaces the wirebond-based electrical connection system with a direct bonding system that simultaneously optimizes both electrical and thermal conduction. The direct bonding approach creates shorter, more efficient thermal pathways from the die to the substrate, reducing thermal resistance and improving overall thermal performance.
3Reliability
If clips and electrically conductive spacers are used instead of wirebonds, then reliability and thermal performance improve, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into the substrate structure itself. The substrate incorporates both mechanical support and electrical interconnection functions through integrated conductive spacers and redistribution layers, eliminating the need for separate wirebond components and reducing overall device complexity despite the advanced bonding technology used.
Solution Approach 2:
The patent implements multi-functional elements where the substrate serves multiple purposes: mechanical support, electrical interconnection, and thermal management. The electrically conductive spacers and redistribution layers provide both structural and electrical functions, reducing the need for additional dedicated components and simplifying the overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves power management, thermal performance, and reliability by reducing the risk of damage to the die and enabling efficient electrical and thermal connections.
Implementation Method 1
pressure sintering the electrically conductive spacer and plurality of die to the clip through the sintering material
Data Source
AI summary
Implementations of semiconductor packages may include one or more die coupled over a substrate, an electrically conductive spacer coupled over the substrate, and a clip coupled over and to the one or more die and the electrically conductive spacer. The clip may electrically couple the one or more die and the electrically conductive spacer.