Conductive Coating for Semiconductor Package EMI Shielding
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Solution Overview
Problem
Existing EMI shielding methods are inefficient for small semiconductor packages, resulting in high costs and low productivity, with inadequate shielding effectiveness.
Innovation Solution
A method involving attaching semiconductor packages to a tape with bumps inserted into holes, allowing for simultaneous coating of five sides using a single operation, reducing manufacturing costs and improving productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If compound materials are used to fill openings in shielding units for EMI shielding, then shielding effectiveness is achieved, but manufacturing complexity and cost increase significantly
Solution Approach 1:
The invention extracts the compound material filling step from the manufacturing process and replaces it with a simple conductive coating applied to the shielding unit's outer surface. This eliminates the complex multi-step process of filling openings with compound materials while maintaining EMI shielding effectiveness through the conductive coating layer.
Solution Approach 2:
The invention uses a simple conductive coating material instead of expensive compound materials that require precise filling. The coating can be applied quickly and removed easily if needed, representing a cheaper and more flexible approach to achieving EMI shielding.
2Object-affected harmful factors
If compound materials fill openings in shielding units, then EMI shielding is achieved, but productivity decreases due to complex processing
Solution Approach 1:
The invention removes the time-consuming compound material filling operation from the manufacturing process. Instead, a conductive coating is applied to the shielding unit's external surface, which can be done in a single step using conventional coating techniques, dramatically improving manufacturing productivity.
Solution Approach 2:
The shielding unit is designed with integrated EMI shielding functionality through its conductive coating, eliminating the need for subsequent filling operations. The shielding capability is built into the structure itself rather than added as a separate complex processing step.
3Object-affected harmful factors
If compound materials are used for EMI shielding, then shielding effect is achieved, but manufacturing cost increases
Solution Approach 1:
The invention replaces expensive compound materials with inexpensive conductive coating materials that can be applied in thin layers. The coating provides sufficient EMI shielding at a fraction of the material cost of compound fillers, significantly reducing manufacturing cost.
Solution Approach 2:
The invention extracts the costly compound material filling step and replaces it with an economical surface coating process. This substitution maintains EMI shielding performance while dramatically reducing material and processing costs.
4Object-affected harmful factors
If small semiconductor packages are shielded using compound material filling, then EMI shielding is achieved, but the process becomes difficult to apply due to size constraints
Solution Approach 1:
The invention uses a conductive coating that can be applied in thin layers suitable for small semiconductor packages. The coating process is adaptable to various package sizes, including small packages where compound material filling would be impractical or impossible to execute precisely.
Solution Approach 2:
The conductive coating approach provides a universal solution for EMI shielding that works across different package sizes and types. The same coating process can be applied to small, medium, and large packages, making the method highly adaptable and versatile compared to size-specific filling operations.
Data Source
AI summary
Disclosed is an EMI shielding method of semiconductor packages, including a tape attaching step of attaching an edge of a tape to a lower side of a frame to dispose the tape inside an inner circumferential side of the frame, a tape cutting step of forming holes through the tape at regular intervals, a semiconductor package fastening step of disposing edges of lower sides of the semiconductor packages on an upper side of the tape so that bumps, formed on the lower sides of the semiconductor packages, are inserted into the holes in the tape to thus fasten the semiconductor packages at regular intervals to the upper side of the tape, and a coating step of performing a coating operation over the tape to form a coat on the semiconductor packages and the upper side of the tape.