Semiconductor Package Heat-Dissipation Interface for Compact Cooling

Solution Overview

Problem

Existing semiconductor packages lack efficient heat dissipation structures, leading to low heat dissipation efficiency and increased package size when additional heat sinks are used.

Innovation Solution

A semiconductor package with a heat-dissipation interface is integrated through panel level packaging, featuring a substrate with a die mounting hole, insulation layer, upper and lower redistribution layers, insulated adhesive, and a dissipation layer, enhancing heat dissipation without additional components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If an additional heat sink is attached onto the surface of the discrete package, then heat dissipation efficiency is improved, but the overall size of the discrete package becomes much larger

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidpackage size

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The heat dissipation function is merged into the substrate structure itself by forming a dissipation layer within the substrate during the packaging process. This eliminates the need for a separate heat sink component, thereby improving heat dissipation efficiency while maintaining a compact package size.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The substrate is designed to serve multiple functions: it provides mechanical support, electrical connection, and heat dissipation. The dissipation layer integrated into the substrate enables the substrate to perform heat dissipation function in addition to its traditional roles, thus improving thermal management without increasing package size.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If an additional heat sink is attached onto the surface of the discrete package, then heat dissipation efficiency is improved, but assembly time increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidassembly time

Core Design Contradiction:

TemperatureVSLoss of time

Solution Approach 1:

The heat dissipation function is merged into the substrate structure itself by forming a dissipation layer within the substrate during the packaging process. This eliminates the need for a separate heat sink component, thereby improving heat dissipation efficiency while maintaining a compact package size.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The dissipation layer is formed within the substrate during the packaging process itself, before the final assembly is complete. This preliminary integration of the heat dissipation structure eliminates the need for subsequent heat sink attachment steps, thereby reducing assembly time.

Inventive Principle:

Principle #10Preliminary action

3Device complexity

If heat energy is dissipated only through the dielectric encapsulant and leads/contacts, then the discrete package structure is simple, but heat dissipation efficiency is relatively low

Engineering Contradiction:

Improvepackage structure complexityVSAvoidheat dissipation efficiency

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

The heat dissipation function is merged into the substrate structure itself by forming a dissipation layer within the substrate during the packaging process. This eliminates the need for a separate heat sink component, thereby improving heat dissipation efficiency while maintaining a compact package size.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The substrate is designed with a dissipation layer that provides enhanced thermal conductivity in the regions where heat generation occurs. This local enhancement of thermal properties allows for more efficient heat dissipation without significantly increasing the overall structural complexity of the package.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves heat dissipation efficiency and reduces package size by integrating a dissipation layer, while also providing noise shielding and anti-electromagnetic interference.

Implementation Method 1

a dissipation layer attached to the insulated adhesive without electrically connecting to the upper RDL and the lower RDL

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

The dissipation layer may also shield external noise and provide anti-electromagnetic interference effect

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS20250253202A1Semiconductor package with heat-dissipation interface

Publication Date: 2025.08.07 PANJIT INT INC

AI summary

A semiconductor package with a heat dissipation interface has a substrate, at least one die embedded in the substrate, an insulation layer encompassing the die and covering the substrate, an upper redistribution layer (RDL) and a lower RDL respectively formed on opposite sides of the substrate, wherein an insulated adhesive comprehensively covers the lower RDL, and a dissipation layer is further bonded on the insulated adhesive. The dissipation layer evenly dissipates excessive heat energy generated by the die, thereby improving the heat dissipation efficiency.