Semiconductor Package Composite Layer for Warping Prevention
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Solution Overview
Problem
Thinner semiconductor packages with embedded fine structures, such as through silicon vias (TSVs), are vulnerable to damage from applied forces, and existing support structures are inadequate, leading to warping and defects during fabrication.
Innovation Solution
A method involving a composite layer with a first molding material surrounding the semiconductor chip and a second molding material on a surface of a first inter-layer, providing support and balancing forces like thermal expansion, while minimizing material usage by not fully encapsulating the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If semiconductor packages are thinned to reduce size, then the package size is reduced, but the package becomes more vulnerable to damage and warping under applied forces
Solution Approach 1:
The support structure is segmented into multiple functional layers: a first molding material layer that provides initial support, a composite layer with first and second inter-layers that provide intermediate support and force balancing, and a second molding material layer that provides final protection. This segmentation allows each layer to be optimized for specific thickness and mechanical properties, enabling overall package thinning while maintaining structural integrity through distributed support.
2Strength
If conventional molding material is used to support the package, then structural support is provided, but material usage is excessive and the package cannot be sufficiently thinned
Solution Approach 1:
Instead of fully encapsulating the semiconductor chip with molding material, the invention applies molding material partially - only where structurally necessary. The first molding material surrounds the chip partially, the composite layer provides targeted support at critical interfaces, and the second molding material provides protection only where needed. This partial action approach provides sufficient structural support while minimizing material volume, enabling package thinning.
Solution Approach 2:
The invention uses a composite layer consisting of alternating organic inter-layers and inorganic barrier layers. This composite structure provides enhanced mechanical support and force balancing properties in a thin profile, replacing what would require much thicker conventional single-material molding. The composite nature allows optimization of both structural support and material efficiency.
3Length of moving object
If forces are applied during grinding or thinning processes, then the package can be thinned, but the package may be damaged or warped
Solution Approach 1:
The first molding material is applied to surround the semiconductor chip before any thinning or grinding operations. This preliminary support structure is in place during subsequent processing steps, providing protection against damage and warping from applied forces. The composite layer is then formed, and finally the second molding material is applied, creating a progressive support system that protects the package throughout the entire fabrication sequence.
Solution Approach 2:
The composite layer introduces parameter changes in material composition and structure at critical locations. The alternating organic and inorganic layers create differential thermal expansion and mechanical properties that balance forces during thinning operations. This parameter variation allows the package to withstand grinding and thinning forces without warping, enabling thickness reduction while maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite layer enhances the semiconductor package's structural integrity, preventing warping and damage under various conditions, while optimizing material usage and supporting the thinning of semiconductor packages.
Implementation Method 1
molding the semiconductor chips with a first molding material... preventing the semiconductor packages being damaged or warped under the forces
Implementation Method 2
providing support and balancing forces like thermal expansion
Data Source
AI summary
Some embodiments of the present disclosure disclose a method for forming semiconductor packages. The method includes disposing a plurality of semiconductor chips over a top side of a wafer, molding the plurality of semiconductor chips with a first molding material, and after molding the semiconductor chips, forming a composite layer over the plurality of semiconductor chips.