Power Semiconductor Package with Conductive Adhesive
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Solution Overview
Problem
The miniaturization of semiconductor dies poses challenges in achieving efficient electrical and thermal performance due to design constraints, contamination risks from lead-free solders, mechanical damage during soldering, and tracking distance issues, especially in high-voltage applications like IGBTs for automotive use.
Innovation Solution
A semiconductor package using a substrate with a support plate, insulation body, and laterally spaced conductive pads, where electrodes are coupled using conductive adhesives, allowing for direct connections and external mounting, and optionally featuring a conductive strap for additional mechanical integration and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the die size is reduced to improve integration density, then the area of the die is reduced, but the ability to achieve large cross-sectional area joints for electrical and thermal performance deteriorates
Solution Approach 1:
The patent transitions from planar connections to three-dimensional stacked connections. Multiple dies are connected vertically through conductive adhesives and solder bumps, creating interlayer connections that provide large cross-sectional areas for electrical and thermal paths without increasing the lateral die area. This vertical dimensionality resolves the contradiction by maintaining connection reliability while enabling die miniaturization.
Solution Approach 2:
The patent implements a stacked configuration where multiple dies are nested vertically one on top of another. Each die is connected to the layer below through conductive adhesive layers and solder bumps, creating a compact three-dimensional structure. This nesting approach allows large cross-sectional area joints to be achieved in the vertical direction while keeping individual die areas small.
2Volume of moving object
If the die is made thinner to reduce package size, then the volume of the die is reduced, but the mechanical strength during soldering deteriorates
Solution Approach 1:
The patent combines multiple thin dies into a stacked assembly where the collective structure provides enhanced mechanical strength. The conductive adhesive layers and solder bumps create a integrated multi-layer structure that distributes mechanical stresses during soldering across multiple bonding interfaces, preventing damage to individual thin dies while maintaining reduced overall volume.
Solution Approach 2:
The patent uses conductive adhesive layers as cushioning elements between the thin dies and the solder joints. These adhesive layers absorb and distribute mechanical stresses during the soldering process, protecting the fragile thin dies from damage. The adhesive layers act as shock-absorbing interfaces that maintain structural integrity throughout assembly.
3Reliability
If larger tracking distances are implemented to meet high-voltage insulation standards, then the electrical insulation performance is improved, but the area occupied by the package increases
Solution Approach 1:
The patent moves insulation and tracking distance requirements from the lateral plane to the vertical dimension. By stacking dies and connections vertically, the package achieves required electrical insulation distances through layer separation and vertical spacing rather than lateral expansion. This allows high-voltage insulation performance to be maintained while keeping the package footprint compact.
Solution Approach 2:
The patent uses thin insulating layers and encapsulation structures to provide electrical isolation between high-voltage and low-voltage regions. The insulation body and encapsulant materials create effective electrical barriers with minimal thickness, achieving required tracking distances without occupying excessive package area. These thin film structures provide efficient insulation in the vertical direction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables reliable assembly and efficient thermal and electrical performance, accommodating smaller die sizes and high-voltage applications while maintaining mechanical integrity and reducing contamination risks, and allows for flexible redistribution of contacts to meet surface insulation requirements.
Implementation Method 1
a first region electrically and mechanically coupled to the first electrode with a conductive adhesive body interposed between the first electrode and the first region
Implementation Method 2
a first region electrically and mechanically coupled to the first electrode with a conductive adhesive body interposed between the first electrode and the first region
Data Source
AI summary
A semiconductor package that includes a substrate having a metallic back plate, an insulation body and a plurality of conductive pads on the insulation body, and a semiconductor die coupled to said conductive pads, the conductive pads including regions readied for direct connection to pads external to the package using a conductive adhesive.