High Power Semiconductor Package Grounding via Conductive Adhesive

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Solution Overview

Problem

Conventional high power semiconductor packages face challenges in performing reliable electrical insulation tests and achieving reliable external grounding due to the insulating properties of heat-resistant grease used between the heat dissipation plate and the base metal layer.

Innovation Solution

The solution involves forming leads electrically connected to the base metal layer, allowing for direct electrical insulation testing between leads and providing independent ground electrodes through these leads, thereby bypassing the need for heat-resistant grease for grounding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If heat-resistant grease is used to attach the heat dissipation plate to the base metal layer, then thermal conductivity is improved, but electrical insulation testing reliability deteriorates

Engineering Contradiction:

Improveheat dissipationVSAvoidelectrical insulation test

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent segments the electrical connection function by introducing a separate conductive adhesive layer between the base metal layer and heat dissipation plate, distinct from the heat-resistant grease. This allows thermal transfer through the grease while electrical connection is established through the conductive adhesive, resolving the contradiction between heat dissipation and insulation testing reliability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The conductive adhesive acts as an intermediary element that provides electrical conductivity between the base metal layer and heat dissipation plate, while the heat-resistant grease maintains its insulating properties for thermal attachment. This intermediary layer enables both thermal management and reliable electrical insulation testing simultaneously.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If heat-resistant grease is used to attach the heat dissipation plate, then thermal attachment is improved, but external grounding reliability deteriorates

Engineering Contradiction:

Improveheat dissipationVSAvoidexternal ground

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent separates the thermal attachment function (performed by heat-resistant grease) from the electrical grounding function (performed by conductive adhesive). This segmentation allows the heat dissipation plate to be thermally attached while maintaining reliable electrical connection to the base metal layer for external grounding purposes.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The conductive adhesive serves as an intermediary that establishes reliable electrical connection for grounding between the heat dissipation plate and base metal layer, while the heat-resistant grease provides thermal attachment. This dual-layer approach resolves the contradiction between thermal attachment and grounding reliability.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If insulation members are added between conductive patterns and low power semiconductor chips, then electrical insulation is improved, but device complexity increases

Engineering Contradiction:

Improveelectrical insulationVSAvoidpackage structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The base insulation layer is designed to serve multiple functions: it provides electrical insulation between the base metal layer and conductive patterns, and also extends to provide insulation between conductive patterns and low power semiconductor chips. This multi-functional design eliminates the need for separate insulation members, reducing device complexity while maintaining insulation reliability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables easy and reliable electrical insulation testing and provides a more reliable external ground, improving the package's insulation and noise attenuation capabilities.

Implementation Method 1

a base metal layer 10 for transmitting the heat to a heat dissipation plate 80

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the heat dissipation plate 80 is generally formed of a metal having superior thermal conductivity

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS7714428B2High power semiconductor package and method of making the same

Publication Date: 2010.05.11 SEMICON COMPONENTS IND LLC

AI summary

A high power semiconductor package includes a substrate including a base metal layer, a base insulation layer formed on the base metal layer, and a plurality of conductive patterns formed on the base insulation layer. In one embodiment one or more high power semiconductor chips are mounted on the substrate, each including a plurality of bonding pads, one or more first package leads having end portions that are electrically connected to the corresponding conductive patterns, and a second lead having an end portion electrically which may be connected to either the base insulation layer or the base metal layer.