Semiconductor Package Dual Heat Dissipation via Conductive Bridge
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Solution Overview
Problem
Existing power semiconductor packages face challenges such as exposed semiconductor die surfaces, inconsistent alignment of components, non-standard piece part designs requiring expensive tool modifications, and the need for component masking and shimming, which hinder optimal reliability and cost-effectiveness.
Innovation Solution
A semiconductor package structure featuring a conductive bridge with coupling portions and alignment features that align and mate with a lead frame, enhancing planarity control and simplifying the assembly process, reducing the need for shimming and masking, and allowing for dual heat dissipation paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If dual heat dissipation path packages are used, then thermal performance and current density are improved, but manufacturing complexity and cost increase due to exposed die surfaces and alignment challenges
Solution Approach 1:
The semiconductor die is nested within a well structure formed in the lead frame, with the die seated in a recess that provides mechanical support and alignment. This nesting approach eliminates the need for separate mounting structures while maintaining dual heat dissipation paths through the lead frame's conductive pathways.
Solution Approach 2:
A molding compound is introduced as an intermediary material that encapsulates the semiconductor die and fills the well structure. This mediator provides mechanical protection, electrical insulation, and thermal management while simplifying the manufacturing process by eliminating the need for separate masking and shimming steps.
2Temperature
If non-standard piece part designs are implemented, then heat dissipation performance improves, but assembly tool cost and complexity increase
Solution Approach 1:
The lead frame is designed with multi-functionality, serving as both the electrical connection structure and the heat dissipation pathway. The well structure formed in the lead frame simultaneously provides mechanical support, alignment features, and thermal conduction, eliminating the need for separate specialized components and reducing tooling requirements.
3Manufacturing precision
If component masking and shimming steps are added, then alignment precision improves, but manufacturing time and cost increase
Solution Approach 1:
Alignment features are pre-formed in the lead frame during its fabrication process, including the well structure and conductive pathways. This preliminary action eliminates the need for separate masking and shimming steps during assembly, as the alignment is built into the base structure itself, thereby maintaining precision while improving manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves assembly efficiency, reduces manufacturing costs, and enhances the reliability of semiconductor packages by ensuring consistent alignment and planarity, while enabling dual heat dissipation for improved thermal performance.
Implementation Method 1
dual heat dissipation paths from both top and bottom surfaces of the package
Data Source
AI summary
In one embodiment, a semiconductor package structure includes a conductive bridge having coupling portions on opposing ends. A lead frame includes alignment or receiving features for receiving the coupling portions of the bridge. A semiconductor device is attached to both the conductive bridge and the lead frame, and is configured so that the coupling portions are on opposing sides of the semiconductor device.