Semiconductor Package Conductive Network for ESD Protection
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Solution Overview
Problem
Semiconductor packages with antennas are vulnerable to electrostatic damage, which affects their performance in wireless communication.
Innovation Solution
A semiconductor package design featuring a main substrate, a semiconductor chip with a conductive network on its second side, and conductive plugs or wires connecting the network to the substrate, along with a conductive bar attached perpendicular to the network, enhancing electromagnetic wave absorption and static electricity discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a semiconductor package includes an antenna for wireless communication, then wireless communication capability is improved, but vulnerability to electrostatic damage increases
Solution Approach 1:
The conductive network is divided into multiple separate conductive regions (first conductive region, second conductive region, third conductive region) that are electrically isolated from each other. This segmentation allows different regions to serve different functions: some regions form the antenna structure for wireless communication, while other regions provide electrostatic discharge paths, thereby resolving the contradiction between wireless communication capability and electrostatic damage resistance
Solution Approach 2:
Different regions of the conductive network are assigned different local functions: the first and second conductive regions are configured for antenna operation and wireless communication, while the third conductive region is specifically designed to provide electrostatic discharge protection. This local differentiation allows the same component (conductive network) to simultaneously fulfill both wireless communication and electrostatic protection requirements
2Loss of energy
If conductive network covers the second side of semiconductor chip, then electromagnetic wave absorption is improved, but device complexity increases
Solution Approach 1:
The conductive network is designed to perform multiple functions simultaneously: it serves as the antenna structure for wireless communication, provides electrostatic discharge paths through separated conductive regions, and absorbs electromagnetic waves through its extensive coverage on the second side of the chip. By making the conductive network multi-functional, the patent avoids adding separate components for each function, thereby managing device complexity while achieving electromagnetic wave absorption
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves the semiconductor package's ability to absorb electromagnetic waves and discharge static electricity, thereby protecting it from electrostatic damage and enhancing wireless communication efficiency.
Implementation Method 1
a conductive network formed on the second side of the semiconductor chip... improving the semiconductor package's ability to absorb electromagnetic waves
Implementation Method 2
conductive plugs or wires connecting the network to the substrate... discharge static electricity, thereby protecting it from electrostatic damage
Data Source
AI summary
A semiconductor package includes a main substrate, a semiconductor chip having a first side and a second side, the first side of the semiconductor chip disposed on the main substrate and electrically connected to the main substrate, and a conductive network formed on the second side of the semiconductor chip.