Semiconductor Package With Conductive Pillars For Heat Dissipation
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Solution Overview
Problem
Current semiconductor packages face challenges in efficiently stacking multiple chips while maintaining reliability and heat dissipation, as they often require through electrodes for electrical connections, which can complicate the stacking process and affect reliability.
Innovation Solution
A semiconductor package design featuring a first semiconductor chip with a larger width than the second chip, allowing for easy heat dissipation, and using conductive pillars for electrical connections between the chips and the substrate, eliminating the need for through electrodes and enabling efficient stacking of multiple chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through electrodes are used for electrical connections in stacked semiconductor packages, then electrical connectivity between chips is achieved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The electrical connection function is segmented into two parts: conductive pillars embedded in the substrate that extend upward, and corresponding contact structures on the chip bottom surface. This segmentation eliminates the need for through electrodes penetrating the entire chip stack, simplifying the manufacturing process while maintaining reliable electrical connections between multiple chips and the substrate
Solution Approach 2:
Conductive pillars are pre-formed in the substrate before chip stacking. This preliminary action allows the electrical connection path to be established in advance, eliminating the need for complex through electrode formation after chip assembly and reducing overall device complexity
2Productivity
If multiple semiconductor chips are stacked vertically, then space utilization and integration density improve, but heat dissipation becomes more difficult
Solution Approach 1:
The first semiconductor chip is designed with asymmetric dimensions where the width in the first direction exceeds the width in the second direction. This asymmetric design creates an extended lateral surface area that serves as an effective heat dissipation path, allowing the chip to dissipate heat laterally while maintaining vertical stacking for high integration density
Solution Approach 2:
Heat dissipation is transitioned from a primarily vertical path to include significant lateral diffusion through the extended chip width. By utilizing the lateral dimension more effectively, the design enables efficient heat dissipation without compromising the vertical stacking arrangement that provides high integration density
3Ease of manufacture
If conductive pillars are placed adjacent to chip edges, then manufacturing alignment is simplified, but electrical connection coverage may be reduced
Solution Approach 1:
The conductive pillars serve multiple functions: they provide electrical connection, define alignment references for chip placement, and their positioning adjacent to chip edges simplifies the alignment process. The contact structures on the chip bottom surface are designed to correspond with these pillar positions, ensuring both manufacturing ease and reliable electrical coverage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for reliable stacking of multiple semiconductor chips with improved heat dissipation and simplified electrical connections, enhancing the package's reliability and manufacturing efficiency.
Implementation Method 1
a plurality of conductive pillars on the first surface of the first semiconductor chip and adjacent to at least one side of the second semiconductor chip. The first semiconductor chip may include a first circuit layer adjacent to the first surface of the first semiconductor chip. The second semiconductor chip and the plurality of conductive pillars may be connected to the first surface of the first semiconductor chip.
Data Source
AI summary
Disclosed is a semiconductor package comprising a first semiconductor chip, a second semiconductor chip on a first surface of the first semiconductor chip, and a plurality of conductive pillars on the first surface of the first semiconductor chip and adjacent to at least one side of the second semiconductor chip. The first semiconductor chip includes a first circuit layer adjacent to the first surface of the first semiconductor chip. The second semiconductor chip and the plurality of conductive pillars are connected to the first surface of the first semiconductor chip.