Semiconductor Package Conductive Post Layout for Reliable Interconnects
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Solution Overview
Problem
The challenge in semiconductor packaging lies in reducing failure rates during fabrication, improving electric connection reliability, and enhancing heat dissipation while accommodating the miniaturization of semiconductor chips, which complicates solder ball attachment and handling, and requires diverse board sizes to integrate multiple chips within a single package.
Innovation Solution
A method involving the formation of a semiconductor package with an insulating layer, seed layer, sacrificial layer, and conductive posts, where laser irradiation patterns the seed layer to form seed patterns and heat-dissipation patterns, allowing for the attachment of a semiconductor chip between conductive posts and subsequent removal of the insulating layer, ensuring coplanar surfaces and improved structural stability and electric characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the size of the semiconductor chip is reduced to increase integration density, then the integration density is improved, but it becomes increasingly difficult to attach solder balls and handle and test them
Solution Approach 1:
The patent replaces traditional mechanical solder ball attachment processes with a substrate-based electrical connection system. Conductive posts are formed directly on the substrate and electrically connected to circuit patterns, eliminating the need for manual or automated solder ball placement on miniaturized chips. This substitution of mechanical assembly with direct electrical interconnection resolves the manufacturing difficulty while maintaining high integration density.
2Quantity of substance
If multiple semiconductor chips are integrated within a single package to accommodate miniaturization, then the integration capability is improved, but the board design complexity increases requiring diverse board sizes
Solution Approach 1:
The patent creates a universal substrate structure that can accommodate multiple semiconductor chips of varying sizes and configurations within a single package. The substrate includes a standardized array of conductive posts and circuit patterns that can be flexibly configured to connect different chip arrangements. This multi-functional design allows the same substrate type to serve various packaging needs, reducing board design diversity while maintaining high integration capability.
3Reliability
If conductive posts are formed with larger dimensions to improve electrical connection reliability, then the electrical connection reliability is improved, but the available space on the substrate is reduced
Solution Approach 1:
The patent extends conductive posts in the vertical dimension rather than increasing their horizontal footprint. Conductive posts are formed as three-dimensional structures with sufficient height and cross-sectional area to provide reliable electrical connection, while their horizontal dimensions remain compact. This vertical expansion allows the substrate to maintain high density of conductive posts and circuit patterns, preserving available space while achieving robust electrical connections.
4Manufacturing precision
If the seed layer is completely removed by laser irradiation to form clean seed patterns, then the pattern definition precision is improved, but the conductive posts may be damaged or removed
Solution Approach 1:
The patent applies laser irradiation with spatially selective energy distribution to different regions of the substrate. The laser parameters (power, duration, focus) are optimized to completely remove the seed layer in areas where clean pattern definition is needed, while using lower energy or shorter duration in areas adjacent to conductive posts to prevent damage. This localized quality control allows precise seed pattern formation without compromising conductive post integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces fabrication failure rates, enhances electric connection reliability, and improves heat dissipation efficiency by maintaining structural stability and lowering interface resistance between conductive posts and seed patterns, while accommodating the miniaturization of semiconductor chips.
Implementation Method 1
performing a laser irradiation process on the seed layer to form seed patterns below the conductive posts
Implementation Method 2
irradiating a laser onto the seed layer and the conductive post to form a seed pattern below the conductive post and a heat-dissipation pattern beside the conductive post
Data Source
AI summary
A method of fabricating a semiconductor package is disclosed. The method may include providing an insulating layer, forming a seed layer to cover a top surface of the insulating layer, forming a sacrificial layer on the seed layer, forming penetration holes to penetrate the sacrificial layer and expose the seed layer, forming conductive posts in the penetration holes, removing the sacrificial layer, performing a laser irradiation process on the seed layer to form seed patterns below the conductive posts, attaching a semiconductor chip to a portion of the insulating layer which is placed between the conductive posts, and removing the insulating layer. An outer side surface of the conductive post and an outer side surface of the seed pattern may be substantially coplanar with each other, thereby forming a flat surface.