Semiconductor Package With Conductive Vias For Thermal Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-density semiconductor packages face thermal electrical issues such as heat dissipation, cross-talk, signal propagation delay, and electromagnetic interference due to increased input/output connections, affecting reliability and quality.
Innovation Solution
A semiconductor package design featuring a base with conductive vias and conductive structures, where the semiconductor die is mounted directly on the base with conductive pillars or solder balls, eliminating the need for conductive pads or redistribution patterns, thereby improving thermal performance and increasing I/O connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of input/output connections is increased to support multi-functional chips, then the functionality and connectivity are improved, but thermal electrical problems such as heat dissipation, cross talk, signal propagation delay, and electromagnetic interference worsen
Solution Approach 1:
The patent transitions from a conventional two-dimensional PCB layout to a three-dimensional stacked architecture. The semiconductor die is mounted vertically on the base substrate with conductive vias extending through the base, creating multiple layers of interconnection. This vertical stacking enables increased I/O connections without expanding the planar footprint, thereby improving adaptability while managing thermal and electrical performance through the third dimension.
Solution Approach 2:
The patent introduces conductive vias as intermediary structures between the semiconductor die and the base substrate. These vias serve as direct thermal and electrical conduits, mediating the transfer of heat and signals from the die to the base. This intermediary structure improves heat dissipation and reduces signal propagation delay compared to conventional trace-based connections, thereby enhancing reliability while supporting increased I/O connections.
2Adaptability or versatility
If conventional PCB fabrication methods are used with increased I/O connections, then connectivity is improved, but linewidth and space requirements increase, requiring DCA development
Solution Approach 1:
The patent employs a vertical stacking architecture where conductive vias extend through the base substrate perpendicular to the conventional planar layout. This three-dimensional arrangement allows multiple I/O connections to be achieved without increasing PCB linewidth or requiring complex redistribution patterns, thereby maintaining ease of manufacture while improving adaptability for high-density connections.
3Reliability
If conductive pads or redistribution patterns are used for mounting, then connection reliability is improved, but manufacturing complexity and thermal resistance increase
Solution Approach 1:
The patent extracts and eliminates the conventional conductive pad and redistribution pattern layers from the mounting structure. Instead, the semiconductor die is mounted directly on the base substrate with conductive vias providing both mechanical support and electrical connection. This extraction simplifies the device structure, reduces manufacturing complexity, and improves thermal conduction by removing intermediate thermal barriers while maintaining connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal dissipation, reduces signal delays, and increases I/O connections, resulting in improved reliability and quality of semiconductor packages by providing a high-density solution.
Implementation Method 1
The conductive structure is in contact with the first terminal surface of the conductive via... This design enhances thermal dissipation
Implementation Method 2
The conductive structure is in contact with the first terminal surface of the conductive via... reduces signal delays
Data Source
Figure 1
Figure 2
Figure 3A
AI summary
The invention provides a semiconductor package. The semiconductor package includes a base having a device-attach surface and a solder-ball attach surface opposite to the device-attach surface. A conductive via is disposed passing through the base. The conductive via includes a first terminal surface aligned to the device-attach surface of the base. A semiconductor die is mounted on the base by a conductive structure. The conductive structure is in contact with the first terminal surface of the conductive via.