Semiconductor Package With Conformal Shield And Segmented Leads
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional leadframe semiconductor packages face challenges with increasing I/O connections and smaller sizes, requiring reduced footprint, lower electric resistance, and higher electric capacity, which they fail to meet effectively.
Innovation Solution
The semiconductor device package design includes a die pad, inner and outer leads, a package body that encapsulates these components, and a conformal shield, with the leads' lateral surfaces exposed or encapsulated to optimize electrical connectivity and shielding, and a manufacturing method involving leadframe strips, connection members, and singulation processes to form the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional leadframe packages are used, then manufacturing cost is low and reliability is high, but package size and footprint cannot be reduced sufficiently
Solution Approach 1:
The leadframe is segmented into inner leads and outer leads with distinct functions. Inner leads provide electrical connections while outer leads provide EMI shielding and structural support. This segmentation allows optimization of each component's size and function independently, reducing overall package footprint while maintaining manufacturing feasibility.
Solution Approach 2:
The patent implements a nested structure where inner leads are positioned within the boundary of outer leads, and the conformal shield encapsulates the entire leadframe assembly. This nesting approach maximizes space utilization, reduces package footprint, and allows multiple functional elements to coexist in a compact configuration.
2Quantity of substance
If more I/O connections are added, then electric capacity increases, but electric resistance and inductance increase
Solution Approach 1:
The patent transitions from planar lead arrangements to a three-dimensional configuration with inner leads extending vertically from the die pad. This dimensional change allows multiple I/O connections to be stacked in the vertical direction rather than spread horizontally, reducing current path length and minimizing resistance and inductance while supporting higher I/O counts.
Solution Approach 2:
The outer leads serve as intermediary elements that provide low-impedance return paths for electrical signals. By positioning outer leads adjacent to inner leads, the patent creates efficient current loops that minimize inductance, allowing high-speed signals to traverse through multiple I/O connections without significant signal degradation.
3Area of stationary object
If package size is reduced, then footprint decreases, but EMI shielding effectiveness deteriorates
Solution Approach 1:
The patent employs a conformal shield that acts as a flexible EMI barrier, conforming to the three-dimensional shape of the leadframe assembly. This thin-film approach provides effective EMI shielding without adding significant volume, allowing compact package design while maintaining electromagnetic compatibility.
Solution Approach 2:
The EMI shielding structure combines conductive outer leads with a conformal shield material to create a composite shielding system. This composite approach provides superior EMI protection compared to single-material solutions, enabling reduced package size while maintaining shielding effectiveness through the synergistic properties of different materials.
Data Source
AI summary
The present disclosure relates to a semiconductor device package and a manufacturing method thereof. The semiconductor package comprises a die pad, a row of leads, a component, a package body, and a conformal shield. The die pad has a top surface. The row of leads comprises a first lead and a second lead, and the row of leads is arranged along a side of the die pad. The first lead has a first lateral surface, and the second lead has a second lateral surface. The component is disposed on the top surface of the die pad. The package body encapsulates the component, the die pad, the first lead, and the second lead, exposes the first lateral surface of the first lead, and covers the second lateral surface of the second lead. The conformal shield covers the package body and connects to the first lateral surface of the first lead.