Semiconductor Package Interposer Layout for Connector Warpage
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Solution Overview
Problem
The existing semiconductor packaging technologies face challenges in efficiently integrating multiple semiconductor chips and capacitors within a compact package, leading to issues such as deformation of conductive connectors, warpage, and insufficient flux cleaning, which affect the reliability and manufacturing costs.
Innovation Solution
A semiconductor package design incorporating a package substrate, interposer, conductive connectors, and a capacitor stack structure with an adhesive film, along with an insulating filler, which provides electrical connections and mechanical support, allowing for a compact and reliable integration of semiconductor chips and capacitors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple semiconductor chips and capacitors are integrated within a compact package, then the device density and functionality are improved, but the risk of deformation of conductive connectors and warpage increases
Solution Approach 1:
An interposer is introduced as an intermediary component between the package substrate and the semiconductor chips. The interposer provides a stable platform with controlled impedance and signal routing, preventing direct mechanical stress transmission to the conductive connectors while enabling high-density integration of multiple chips and capacitors.
Solution Approach 2:
The package structure is segmented into distinct functional layers: package substrate, interposer, semiconductor chips, and capacitor stack structures. This segmentation allows each component to be optimized independently and reduces cumulative stress that would otherwise cause connector deformation and warpage.
2Adaptability or versatility
If embedded or surface-mounted capacitors are used, then the electrical functionality is improved, but the manufacturing complexity and cost increase
Solution Approach 1:
Capacitor stack structures are merged directly with the interposer in a monolithic integration approach. The capacitors are formed as part of the interposer fabrication process using alternating layers of conductive and dielectric materials, eliminating the need for separate embedded or surface-mounted capacitor components and their associated complex assembly steps.
3Volume of moving object
If the package size is reduced, then the portability is improved, but the space for flux cleaning becomes insufficient
Solution Approach 1:
The capacitor stack structures extend in the vertical dimension (Z-direction) rather than occupying horizontal space. This vertical stacking approach provides sufficient clearance for flux cleaning operations in the lateral dimensions while maintaining a compact overall package footprint, as the cleaning access is provided from the top surface.
4Strength
If conductive connectors are made more robust, then the mechanical strength is improved, but the deformation risk increases
Solution Approach 1:
The interposer acts as a mechanical intermediary that absorbs and distributes stress away from the conductive connectors. By providing a rigid intermediate platform, the interposer prevents direct transmission of mechanical forces that would cause connector deformation while maintaining overall structural strength.
Solution Approach 2:
The interposer provides beforehand cushioning by absorbing thermal expansion differences and mechanical stresses before they can propagate to the conductive connectors. This pre-cushioning effect prevents deformation during manufacturing and operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability and mechanical robustness of the semiconductor package by preventing deformation of conductive connectors, ensuring uniform height, and reducing manufacturing costs by eliminating embedded or surface-mounted capacitors, while maintaining sufficient space for flux cleaning.
Implementation Method 1
an adhesive film between the first and second capacitors
Data Source
AI summary
A semiconductor package includes a package substrate, an interposer, a semiconductor chip between the package substrate and the interposer, a plurality of conductive connectors between the package substrate and the interposer, and a capacitor stack structure between the package substrate and the interposer, the capacitor stack structure including a first capacitor connected to the package substrate, and a second capacitor connected to the interposer.