Semiconductor Package Constraint Structures for Resonance Control
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Solution Overview
Problem
Inertial measurement units (IMUs) in semiconductor packages, such as SOIC, are prone to structural integrity issues due to resonance frequency interference from adjacent devices, leading to potential damage and interference from low-frequency noise and vibrations.
Innovation Solution
A semiconductor package structure incorporating a first and second constraint structure, where the second constraint structure includes a substrate core layer and a metal layer, is connected to the package device, modifying its resonance frequency by creating additional nodes for standing waves and increasing stiffness, thus preventing interference and damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional semiconductor package structure is used, then the device can be manufactured with standard processes, but the structural integrity is deteriorated due to resonance frequency interference from adjacent devices
Solution Approach 1:
The package structure is segmented by adding constraint structures that divide the package into distinct regions with different mechanical properties. The first constraint structure is connected to the semiconductor package device, while the second constraint structure is positioned under the projection of the package device, creating segmented support zones that modify vibration patterns and reduce resonance interference.
Solution Approach 2:
The constraint structures extend the support system into the vertical dimension by positioning the second constraint structure underneath the package device projection. This three-dimensional arrangement of constraint structures creates additional support nodes that alter the resonance characteristics and increase structural rigidity without expanding the planar footprint.
2Object-affected harmful factors
If additional constraint structures are added to increase stiffness and modify resonance frequency, then the resistance to vibration and noise is improved, but the device complexity increases
Solution Approach 1:
The constraint structures serve multiple functions simultaneously: they provide mechanical support, modify resonance frequencies, increase structural stiffness, and reduce vibration and noise. By integrating these multifunctional constraint structures into the package design, the solution addresses multiple problems without proportionally increasing complexity.
Solution Approach 2:
The constraint structures change key mechanical parameters of the package system, including stiffness, resonance frequency, and damping characteristics. By carefully designing the constraint structures to achieve specific parameter targets, the solution optimizes vibration and noise resistance while controlling the increase in structural complexity.
Data Source
AI summary
A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a semiconductor package device, a first constraint structure and a second constraint structure. The first constraint structure is connected to the semiconductor package device. The second constraint structure is connected to the semiconductor package device and under a projection of the semiconductor package device.