Semiconductor Package Contact Layers Without Chemical Plating

The patent replaces expensive chemical plating with a cost-effective screen printing process using conductive paste. The paste is applied directly to the PCB laminate to create electrical interconnects, eliminating the need for costly electroplating while maintaining functional electrical connectivity. This approach treats the conductive paste as a disposable material that achieves the required electrical connection without expensive metal deposition.

The patent substitutes the chemical/electrical process of electroplating with a mechanical screen printing process. Instead of using electrical current to deposit metal layers, the invention uses physical screen printing to apply conductive paste, followed by thermal processing to sinter the paste and create conductive traces. This mechanical substitution dramatically reduces manufacturing cost.

The patent introduces an inlay as an intermediary component between the semiconductor die and the PCB laminate. This inlay serves as a protective mediator that shields the die from mechanical damage and prevents direct contact with the PCB laminate material. The inlay includes through-holes that allow electrical connections while maintaining physical protection of the embedded die.

The inlay provides beforehand cushioning and protection for the semiconductor die before it is exposed to potential damage sources. By embedding the die within the inlay structure first, then integrating the inlay into the PCB, the die is pre-protected from mechanical stresses and electrical contamination that would otherwise occur during direct embedding.