Semiconductor Package Interconnect Layout for Contact Misalignment
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Solution Overview
Problem
Semiconductor chips with increased I/O connections face shifting or rotating during manufacturing processes, leading to defective package structures and reduced yield due to misalignment of electrical contacts, which complicates the formation of effective interconnection structures.
Innovation Solution
A method for manufacturing semiconductor packages involves measuring the actual positions of electrical contacts and forming an interconnection structure based on these positions using a mask-less process to ensure accurate connection and maintain signal integrity, incorporating multiple circuit layers if necessary to meet electrical performance criteria.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor chips are integrated with an increasing number of electronic components to achieve improved electrical performance and additional functions, then the electrical performance and functionality are improved, but the chips are more prone to shifting or rotating during manufacturing processes, leading to reduced yield
Solution Approach 1:
The patent applies preliminary action by measuring the actual positions of electrical contacts on the semiconductor chip before forming the interconnection structure. This advance measurement allows the system to compensate for any shifting or rotating that occurred during manufacturing, ensuring accurate alignment in the final interconnection structure despite positional variations.
Solution Approach 2:
The patent changes the parameters of the interconnection structure formation process by using a mask-less process that can accommodate actual measured positions of electrical contacts. This allows the interconnection structure to be formed with precise alignment to the actual contact positions, rather than relying on fixed mask patterns that would be misaligned due to chip shifting or rotating.
2Ease of manufacture
If the semiconductor chips shift or rotate during the pick-and-place process and/or the molding process, then the manufacturing process becomes more challenging, but the effective areas of the pads are limited, making it more difficult to form an effective interconnection structure
Solution Approach 1:
The patent measures the actual positions of electrical contacts before forming the interconnection structure, enabling the system to plan and execute the interconnection formation with precise alignment to the actual contact locations, regardless of chip position variations during manufacturing.
Solution Approach 2:
The patent replaces the traditional mechanical mask-based patterning system with a mask-less process that uses actual measured position data to guide the formation of the interconnection structure. This substitution allows for dynamic adjustment and precise alignment without being constrained by fixed mask patterns, thereby improving ease of manufacture despite chip shifting or rotating.
3Manufacturing precision
If a mask-less process is used to form the interconnection structure based on actual positions of electrical contacts, then the alignment precision is improved, but the process complexity increases
Solution Approach 1:
The patent replaces the traditional mechanical mask-based patterning system with a mask-less process that uses actual measured position data to guide the formation of the interconnection structure. This substitution eliminates the need for physical masks and allows for direct, precise patterning based on measured contact positions, improving alignment precision while the added measurement and data processing steps are managed through automated systems.
Solution Approach 2:
The patent creates a digital copy or representation of the actual electrical contact positions through measurement, and then uses this digital information to guide the formation of the interconnection structure. This copying approach allows for precise alignment without requiring physical masks, and the digital data can be easily processed and stored, managing the increased process complexity through information-based rather than purely mechanical means.
Data Source
AI summary
A semiconductor package structure and a method for manufacturing the same are provided. The method includes: providing a package body includes a first semiconductor device, wherein the first semiconductor device includes a plurality of first electrical contacts disposed adjacent to an active surface of the first semiconductor device; measuring the actual positions of the first electrical contacts of the first semiconductor device; providing a plurality of second electrical contacts outside the first semiconductor device; and forming an interconnection structure based on the actual positions of the first electrical contacts of the first semiconductor device and the positions of the second electrical contacts satisfying a predetermined electrical performance criterion by a mask-less process, so as to connect the first electrical contacts and the second electrical contacts and maintain signal integrity during transmission.