Semiconductor Package with Coolant Recess for Thermal Management
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Solution Overview
Problem
Semiconductor packages using FR4 substrates face non-ideal cooling performance, which limits their thermal resistance and cooling efficiency, particularly in high-power applications.
Innovation Solution
Incorporating a coolant receiving recess in the encapsulation material of the package to house a thermally conductive coolant, such as thermal grease, which enhances heat dissipation and can be circulated through microfluidic channels for efficient cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If FR4 substrate is used in semiconductor packages, then manufacturing ease and cost are improved, but cooling performance and thermal resistance are worsened
Solution Approach 1:
The encapsulation material is segmented to include a coolant receiving recess that houses a coolant, separating the structural support function (FR4 substrate) from the thermal management function (coolant in recess). This allows each component to be optimized independently for its specific function.
Solution Approach 2:
A coolant (thermal grease or liquid) is introduced as an intermediary substance between the chip and the external environment, mediating heat transfer from the chip through the encapsulation material to improve cooling performance without requiring changes to the FR4 substrate itself.
2Device complexity
If FR4 substrate is used in semiconductor packages, then device simplicity is improved, but thermal resistance is worsened
Solution Approach 1:
The coolant receiving recess is formed within the encapsulation material, creating a nested structure where the coolant is housed inside the encapsulation. This allows thermal management functionality to be integrated within the existing package structure without adding external complexity.
Solution Approach 2:
The encapsulation material incorporates a coolant receiving recess that can hold thermal grease or liquid coolant, effectively using the encapsulation material as both structural support and thermal management medium through its modified porous or cavity-containing structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves the cooling performance of semiconductor packages by effectively dissipating heat, thereby reducing thermal resistance and enhancing the reliability of high-power applications.
Implementation Method 1
Incorporating a coolant receiving recess in the encapsulation material of the package to house a thermally conductive coolant, such as thermal grease, which enhances heat dissipation
Implementation Method 2
can be circulated through microfluidic channels for efficient cooling
Data Source
AI summary
In various embodiments, a package may be provided. The package may include a chip carrier. The package may further include a chip arranged over the chip carrier. The package may also include encapsulation material encapsulating the chip and partially the chip carrier. A coolant receiving recess may be provided over the chip in the encapsulation material, wherein the coolant receiving recess is configured to receive coolant.