Semiconductor Package Cooling Patches for Heat and Connector Stability
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving improved reliability and efficient heat dissipation due to physical and economic limitations, particularly in managing high heat generation and maintaining structural integrity during manufacturing processes.
Innovation Solution
A semiconductor package design incorporating a package substrate, interposer, semiconductor chip, and cooling patches with cylindrical shapes and high thermal conductivity, along with an insulation filler, to enhance heat dissipation and structural stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional packaging structures are used, then manufacturing is simpler, but heat dissipation efficiency deteriorates
Solution Approach 1:
The packaging structure is divided into multiple functional layers including substrate, interposer, semiconductor chip, and molding compound, with each layer performing specific functions. This segmentation allows optimized heat dissipation pathways while maintaining manufacturing feasibility.
Solution Approach 2:
The patent employs composite materials with different thermal conductivities in various layers. The interposer and molding compound are specifically designed as composite structures that balance thermal management requirements with mechanical integrity and manufacturability.
2Temperature
If high thermal conductivity materials are used for cooling, then heat dissipation improves, but manufacturing precision requirements increase
Solution Approach 1:
High thermal conductivity materials are applied locally in specific regions where heat generation is highest, rather than throughout the entire package. This localized approach optimizes cooling efficiency while reducing the overall manufacturing precision requirements and cost.
Solution Approach 2:
The patent incorporates design features that preemptively compensate for thermal expansion and connector deformation during manufacturing and operation. This beforehand cushioning approach prevents precision issues rather than attempting to eliminate them entirely.
3Volume of moving object
If compact packaging is used, then form factor reduces, but heat management becomes more difficult
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat management by stacking multiple functional layers vertically. This dimensional transition allows compact form factor while maintaining effective heat pathways through the interposer and molding compound to the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves cooling efficiency and reliability by effectively managing heat from high-power semiconductor chips, preventing deformation of conductive connectors, and ensuring uniformity and integrity of the package structure.
Implementation Method 1
cooling patches arranged between the semiconductor chip and the interposer... thermal conductivity of each of the plurality of cooling patches is greater than thermal conductivity of the lower protective layer
Data Source
AI summary
A semiconductor package comprising: a package substrate; an interposer disposed on the package substrate; a first semiconductor chip disposed on the interposer; a heat dissipation device disposed on the first semiconductor chip; and a plurality of cooling patches disposed between the heat dissipation device and the first semiconductor chip. The plurality of cooling patches directly contact the first semiconductor chip, and the plurality of cooling patches directly contact the heat dissipation device.