Semiconductor Package Substrate Copper Pad Adhesive Member
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Solution Overview
Problem
The existing semiconductor package substrate systems require an additional process to form a dummy die for stacking memory chips, increasing production costs and reducing productivity due to the use of expensive silicon material and additional thickness.
Innovation Solution
A semiconductor package substrate is developed using a copper pad and adhesive member formed through hybrid bump technology without the expensive dummy die, enabling improved adhesive strength and fine pitch capabilities, and utilizing copper core solder balls for high stand-off height after reflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dummy die is formed between the semiconductor substrate and memory chip for stacking, then the memory chip can be attached while spacing from the substrate, but an additional process is required and productivity is reduced
Solution Approach 1:
The invention extracts and eliminates the dummy die component from the package structure. Instead of using a separate dummy die to provide spacing and attachment surface, the patent directly forms the adhesive member on the semiconductor substrate, removing the unnecessary intermediate component and simplifying the manufacturing process.
Solution Approach 2:
The invention merges the functions of the dummy die (spacing and attachment) directly into the semiconductor substrate by forming the adhesive member on the substrate surface. This combines multiple functions into a single integrated structure, eliminating the need for separate dummy die fabrication and attachment processes.
2Reliability
If a silicon dummy die is used for stacking, then the memory chip can be mounted, but the cost of the entire package system is increased
Solution Approach 1:
The invention replaces the expensive silicon dummy die with a cost-effective adhesive member that can be directly formed on the semiconductor substrate. The adhesive member serves the necessary function of providing attachment surface and spacing without requiring expensive silicon material, thereby reducing overall manufacturing cost.
Solution Approach 2:
The invention changes the material parameter from expensive silicon (dummy die) to cost-effective adhesive materials. This material substitution maintains the functional requirements for attachment and spacing while significantly reducing the cost of the package system.
3Reliability
If a silicon dummy die with predetermined thickness is used, then the memory chip can be spaced from the substrate, but the entire thickness of the package system is increased
Solution Approach 1:
The invention uses a thin adhesive member film instead of a thick rigid silicon dummy die to provide the necessary spacing function. The adhesive member achieves the required separation between substrate and memory chip with minimal thickness, reducing the overall package thickness while maintaining functional performance.
4Quantity of substance
If multiple memory chips are stacked to increase capacity, then the data storage capacity increases, but high level technique is required from design to production stage
Solution Approach 1:
The invention segments the manufacturing process into standardized, repeatable steps for attaching multiple memory chips to the substrate. By eliminating the dummy die step and using direct adhesive formation, each chip attachment becomes an independent, simplified operation that can be easily replicated for multi-chip stacking, reducing overall process complexity.
Data Source
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AI summary
According to the embodiment, there is provided a semiconductor package substrate including an insulating substrate, a circuit pattern on the insulating substrate, a protective layer formed on the insulating substrate to cover the circuit pattern on the insulating substrate, a pad formed on the protective layer while protruding from a surface of the protective layer, and an adhesive member on the pad.