Semiconductor Package Core Member and Vertical Conductor Etching

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Solution Overview

Problem

Semiconductor packages face challenges in achieving improved rigidity and heat dissipation while minimizing manufacturing complexity and costs, as existing solutions often require multiple processing steps that increase costs and reduce yield.

Innovation Solution

A semiconductor package design that includes a core member and vertical connection conductor formed from the same metal material, with tapered cross-sectional shapes, which are etched simultaneously from a single metal plate to enhance rigidity, warpage characteristics, and heat dissipation, and are integrated with a redistribution substrate and encapsulant to form an electrical connection path.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If multiple processing steps are used to achieve improved rigidity and heat dissipation, then the package performance is improved, but the manufacturing complexity and costs increase

Engineering Contradiction:

ImproverigidityVSAvoidmanufacturing complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The core member and vertical connection conductors are formed as a single integrated structure from one metal plate through simultaneous etching, combining multiple components that would traditionally require separate processing steps. This merging reduces manufacturing complexity while maintaining the rigidity benefits of the core member and the electrical connectivity of the vertical connection conductors.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The metal plate serves multiple functions: it provides the core member for structural rigidity, forms the vertical connection conductors for electrical connectivity, and creates the encapsulant recess for housing the semiconductor chip. This multi-functionality eliminates the need for separate components and processing steps for each function.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If multiple processing steps are used to achieve improved rigidity and heat dissipation, then the package performance is improved, but the manufacturing costs increase

Engineering Contradiction:

Improveheat dissipationVSAvoidmanufacturing costs

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

3Stability of the object's composition

If the vertical connection conductor has a tapered shape with narrower lower surface, then the warpage characteristics are improved, but the electrical connection area is reduced

Engineering Contradiction:

Improvewarpage characteristicsVSAvoidelectrical connection area

Core Design Contradiction:

Stability of the object's compositionVSArea of stationary object

Solution Approach 1:

The vertical connection conductor features a tapered shape with different cross-sectional areas at different heights, creating local quality variations. The narrower lower portion reduces stress and improves warpage characteristics, while the wider upper portion maintains adequate electrical connection area with the redistribution layer.

Inventive Principle:

Principle #3Local quality

4Productivity

If the core member and vertical connection conductor are formed from the same metal material simultaneously, then the manufacturing steps are reduced, but the design flexibility is limited

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoiddesign flexibility

Core Design Contradiction:

ProductivityVSAdaptability or versatility

Solution Approach 1:

Although formed from the same metal plate, the core member and vertical connection conductors are segmented into distinct functional regions through selective etching. The etching process creates separate through-holes and structural features that define the boundaries and functions of each component, allowing independent design optimization while maintaining manufacturing efficiency.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS11538737B2Semiconductor package

Publication Date: 2022.12.27 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor package includes a redistribution substrate having a first redistribution layer, a semiconductor chip on the redistribution substrate and connected to the first redistribution layer, a vertical connection conductor on the redistribution substrate and electrically connected to the semiconductor chip through the first redistribution layer, a core member having a first through-hole accommodating the semiconductor chip and a second through-hole accommodating the vertical connection conductor, and an encapsulant covering at least a portion of each of the semiconductor chip, the vertical connection conductor, and the core member, the encapsulant filling the first and second through-holes, wherein the vertical connection conductor has a cross-sectional shape with a side surface tapered to have a width of a lower surface thereof is narrower than a width of an upper surface thereof, and the first and second through-holes have a cross-sectional shape tapered in a direction opposite to the vertical connection conductor.