Semiconductor Package Layout Without Upper Redistribution Layer
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Solution Overview
Problem
Existing semiconductor packages face challenges in efficiently dissipating heat and ensuring reliable electrical connections while maintaining productivity and economic efficiency, particularly in highly-integrated semiconductor chips with increased connection terminals.
Innovation Solution
A semiconductor package design that includes a lower redistribution structure with core layers and encapsulation material, where the core wires extend through the encapsulation material to connect with upper pads, and a heat dissipation structure on the encapsulation material, eliminating the need for an upper redistribution structure, thereby enhancing heat dissipation and connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an upper redistribution structure is used to connect core wires to upper pads, then electrical connection reliability is improved, but device complexity and manufacturing steps increase
Solution Approach 1:
The patent removes the upper redistribution structure from the semiconductor package design. Instead of using a separate upper redistribution layer to connect core wires to upper pads, the core wires are directly extended to reach and connect with the upper pads, thereby simplifying the overall structure while maintaining electrical connection reliability.
Solution Approach 2:
The patent merges the function of the upper redistribution structure with the core wire structure. By extending the core wires directly to the upper pads, the design combines the wiring and connection functions into a single integrated structure, eliminating the need for a separate upper redistribution layer.
2Temperature
If heat dissipation structures are added to improve thermal characteristics, then temperature control is improved, but device complexity increases
Solution Approach 1:
The patent designs the upper pads to serve multiple functions: they act as both electrical connection terminals and heat dissipation structures. By making the upper pads coplanar with the heat dissipation structure and integrating their functions, the design improves thermal characteristics without adding separate dedicated heat dissipation components.
Solution Approach 2:
The patent combines the electrical connection function and heat dissipation function into a single integrated structure. The upper pads and heat dissipation structure are merged into one component that performs both electrical connectivity and thermal management functions simultaneously.
3Reliability
If encapsulation material is used to cover core layer and semiconductor devices, then protection is improved, but risk of cracks increases
Solution Approach 1:
The patent removes the upper redistribution structure that was located within or beneath the encapsulation material. By eliminating this internal structure, the encapsulation material can cover only the essential components (core layer and semiconductor devices) without having to accommodate or protect additional wiring layers, thereby reducing stress concentration points and the risk of cracks.
4Reliability
If multiple manufacturing steps are used to ensure connection reliability, then electrical connection reliability is improved, but productivity decreases
Solution Approach 1:
The patent eliminates the manufacturing steps required to form and pattern the upper redistribution structure. By removing this component entirely and directly extending core wires to upper pads, the manufacturing process is simplified, reducing the number of steps while maintaining connection reliability.
Solution Approach 2:
Instead of following the conventional approach of first creating an upper redistribution structure and then connecting core wires to it, the patent inverts the sequence by directly extending core wires to connect with upper pads, thereby eliminating unnecessary intermediate manufacturing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation, reduces the risk of encapsulation material cracks, and enhances the reliability and productivity of semiconductor packages by optimizing electrical connections and eliminating the need for additional manufacturing steps.
Implementation Method 1
a heat dissipation structure laterally apart from the second semiconductor device and disposed above the first semiconductor device
Implementation Method 2
the core wires include core patterns and core vias, upper vias at least partially extend through the encapsulation material and upper pads are on uppermost of the core patterns
Data Source
AI summary
A semiconductor package may include a lower redistribution structure including redistribution patterns, a first semiconductor device on the lower redistribution structure, a core layer laterally apart from the first semiconductor device, the core layer on the lower redistribution structure and including a core insulating layer and core wires, an encapsulation material on the lower redistribution structure and at least partially covering side and upper surfaces of the core layer and of the first semiconductor device, a second semiconductor device on the encapsulation material, and a heat dissipation structure.