Semiconductor Package Corner Spacers for Signal Integrity
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Solution Overview
Problem
Existing semiconductor packages face challenges in efficiently connecting multiple stacked semiconductor chips while maintaining physical stability and reducing signal propagation time and energy loss.
Innovation Solution
A semiconductor package design featuring a substrate with a signal pattern, a first semiconductor chip, spacers, and a chip stack where the spacers and first semiconductor chip are positioned adjacent to the corners of the lowermost second semiconductor chip, and signal pads are strategically placed to shorten electrical paths, with a molding layer covering the stack for support and reduced voids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple semiconductor chips are stacked to increase integration density, then device functionality and capacity are improved, but signal propagation time and energy loss increase due to longer electrical paths
Solution Approach 1:
The patent transitions from planar chip arrangement to vertical stacking, utilizing the third dimension (height) to increase integration density. Multiple chips are stacked vertically with connection pads arranged in corresponding positions, allowing electrical connections to be made through vertical vias rather than long horizontal traces, thereby reducing signal propagation time despite increased chip count.
Solution Approach 2:
Connection pads are strategically positioned at specific locations (corners and edges) of each chip to optimize electrical connection paths. The pad layout is locally optimized at each stacking interface to minimize via length and electrical path resistance, addressing the signal propagation issue locally at each connection point rather than requiring global redesign.
2Quantity of substance
If multiple semiconductor chips are stacked to increase integration density, then device functionality and capacity are improved, but signal energy loss increases due to longer electrical paths
Solution Approach 1:
By stacking chips vertically and using vertical vias for inter-chip connections, the electrical path length is significantly reduced compared to planar routing. This dimensional change minimizes resistive losses and energy dissipation in the interconnects, maintaining signal energy efficiency despite increased chip integration.
Solution Approach 2:
Connection pads are positioned at optimal locations to minimize via length and electrical resistance at each stacking interface. This local optimization of pad placement reduces energy loss at each connection point, and the cumulative effect across multiple stacks maintains overall signal energy efficiency.
3Loss of time
If connection pads are positioned closer to reduce electrical path length, then signal propagation time and energy loss are reduced, but physical stability and load distribution are compromised
Solution Approach 1:
Connection pads are positioned asymmetrically at corners and edges of chips rather than uniformly distributed. This asymmetric placement optimizes electrical connection paths while the overall chip stack geometry and support structures provide mechanical stability, balancing electrical and mechanical requirements through non-uniform pad distribution.
Solution Approach 2:
The chip stack is divided into multiple stacking interfaces, each with its own connection pad arrangement. This segmentation allows independent optimization of electrical connections at each interface while the cumulative structure maintains overall mechanical stability through distributed bonding across multiple interfaces.
4Loss of energy
If connection pads are positioned closer to reduce electrical path length, then signal energy loss is reduced, but capacitive effects and signal integrity are worsened
Solution Approach 1:
Vertical via connections replace horizontal trace routing, significantly reducing inductance and resistance. The three-dimensional via-in-pad or near-pad configuration minimizes loop area and parasitic effects, improving signal integrity while reducing energy loss compared to traditional planar connections.
Solution Approach 2:
Connection pads are locally optimized at each stacking interface with specific geometry and material composition to minimize parasitic capacitance and inductance. The local pad design at each via location is tuned to reduce capacitive coupling and signal reflection, maintaining signal integrity across the stacked structure.
Data Source
AI summary
A semiconductor package includes a substrate including a signal pattern on an upper surface thereof, a chip stack on the substrate, and a first semiconductor chip and one or more spacers between the substrate and the chip stack. The chip stack includes one or more second semiconductor chips stacked on the substrate. The one or more spacers and the first semiconductor chip are adjacent to respective corners of a lowermost second semiconductor chip, in plan view. The one or more spacers have the same planar shape as the first semiconductor chip.