Semiconductor Package Cover Member EMI Shielding
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Solution Overview
Problem
Conventional semiconductor packages face challenges in reducing electromagnetic interference (EMI) due to the difficulty in applying effective shielding, especially in wafer-level packaging, which increases manufacturing costs and does not adequately cover side surfaces, leading to inefficiencies in noise reduction and signal speed enhancement.
Innovation Solution
A semiconductor package design that includes a cover member with a conductive material, such as copper, gold, or silver, covering side surfaces of the chip and wiring, and an encapsulant to seal the cover member, along with a rewiring layer and insulating layers, which also includes a half-sawing process to increase the contact area for effective EMI shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding film is formed by sputtering on individual packages, then EMI shielding performance is improved, but manufacturing cost increases
Solution Approach 1:
The patent applies preliminary action by forming the shielding film on the entire substrate before cutting into individual packages. This allows the shielding process to be performed at the wafer level rather than on individual packages, reducing manufacturing cost while maintaining EMI shielding effectiveness. The shielding film is deposited in advance before the packages are separated.
Solution Approach 2:
The patent merges the shielding process with the substrate manufacturing process by forming the shielding film on the substrate before cutting. This combines what would otherwise be separate processes (substrate fabrication and EMI shielding) into a single integrated workflow, improving efficiency and reducing costs.
2Volume of stationary object
If shielding is applied to PCBs and connectors, then system size is reduced, but EMI shielding performance is insufficient
Solution Approach 1:
The patent applies local quality by placing the shielding film specifically on the substrate and wiring structures where EMI protection is most needed, rather than providing uniform shielding throughout the entire system. This targeted approach provides effective EMI shielding while minimizing the volume occupied by shielding materials.
3Productivity
If the substrate is cut after sputtering, then individual packages are obtained, but shielding film is not formed on side surfaces of the substrate
Solution Approach 1:
The patent extends the shielding solution to another dimension by forming the shielding film not only on the upper surface but also on the side surfaces of the substrate. This multi-dimensional coverage ensures complete EMI shielding even after the substrate is cut into individual packages, addressing the coverage gap in the conventional approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces EMI, minimizes noise, and enhances signal speed while simplifying the manufacturing process and reducing costs by forming the cover member at the wafer level, providing both shielding and mechanical protection to the semiconductor chip.
Implementation Method 1
a cover member configured to cover side surfaces of the semiconductor chip and the wiring and be in contact with at least one wiring layer
Data Source
AI summary
Disclosed herein are a semiconductor package and a method of manufacturing the same. The semiconductor package according to embodiments of the present disclosure includes a wiring including a plurality of layers including an insulating layer and a wiring layer, a semiconductor chip mounted on the wiring and electrically connected to the wiring layer through a bonding pad, a cover member configured to cover side surfaces of the semiconductor chip and the wiring and be in contact with at least one wiring layer, and an encapsulant configured to seal the cover member. Accordingly, the cover member covers the semiconductor chip and is in contact with the wiring formed under the semiconductor chip, thereby reducing electromagnetic interference, minimizing noise between operations of the semiconductor package, and improving a signal speed.