Semiconductor Package Support Layout for Horizontal Cover Glass
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Solution Overview
Problem
In semiconductor packages, the inclination of a protective material, such as a cover glass, with respect to the substrate plane due to the liquid state of the resin before curing, leads to light refraction and image distortion, and contact with wires results in damage and noise.
Innovation Solution
A semiconductor package design that includes a support structure on the chip plane to elevate the protective material above the bumps and wires, preventing contact and ensuring a horizontal arrangement of the protective material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the resin is applied thinly to arrange the protective material horizontally, then the protective material can be arranged horizontally with respect to the substrate plane, but the wires may be damaged by coming into contact with the protective material
Solution Approach 1:
The patent segments the support function by introducing separate support structures (protrusions or elevated regions) that are spatially distinct from the wire bonding areas. This segmentation allows the protective material to be supported at a safe height without interfering with wire integrity, resolving the contradiction between horizontal arrangement precision and wire protection.
Solution Approach 2:
The patent resolves the contradiction by transitioning from a two-dimensional planar arrangement to a three-dimensional structured arrangement. By creating elevated support regions in the vertical dimension, the protective material can be positioned horizontally without requiring thin resin application that would compromise wire safety.
2Ease of manufacture
If the protective material is placed on liquid resin before curing, then the protective material can be positioned, but the surface becomes inclined instead of being horizontal with respect to the substrate plane
Solution Approach 1:
The patent applies preliminary action by pre-forming elevated support structures on the substrate before applying the resin and placing the protective material. These pre-formed supports provide immediate geometric constraints that ensure horizontal alignment, eliminating the inclination problem that occurs when relying solely on liquid resin positioning.
Solution Approach 2:
The patent introduces an intermediary element (the elevated support structure formed by protrusions or raised regions) that mediates between the substrate and the protective material. This intermediary provides a stable, pre-formed platform that ensures horizontal positioning without requiring the protective material to be placed directly on liquid resin.
3Reliability
If the protective material is arranged horizontally without contact with wires, then image quality is maintained, but additional support structures are required increasing device complexity
Solution Approach 1:
The patent applies universality by designing support structures that serve multiple functions: they provide mechanical support for horizontal alignment, define positioning zones, and can integrate with existing substrate features. This multi-functionality reduces the need for separate dedicated support components, thereby limiting the increase in device complexity while maintaining image quality.
Solution Approach 2:
The patent applies local quality by implementing support structures only in specific localized regions where needed, rather than across the entire substrate. By concentrating support features in targeted areas, the device complexity is minimized while still achieving the necessary horizontal alignment to prevent image distortion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents the protective material from coming into contact with wires, eliminating image distortion and wire damage, while also improving heat dissipation and reducing manufacturing costs.
Implementation Method 1
the adhesive may be an ultraviolet-curable resin. This has an effect that the protective material is bonded to the semiconductor chip by irradiation with ultraviolet rays
Implementation Method 2
the adhesive may be a thermosetting resin. This has an effect that the protective material is bonded to the semiconductor chip by heat treatment
Implementation Method 3
a support provided on the chip plane to support the protective material at a position where a height from the chip plane is higher than the bumps
Implementation Method 4
electrodes may be provided on each of the protective material and the semiconductor chip, and the support may be connected to the electrodes. This has an effect that the performance of dissipating the heat generated by the semiconductor chip is improved
Data Source
AI summary
To arrange a protective material horizontally with respect to a substrate plane without the protective material coming into contact with wires in a wire-bonded semiconductor package.The semiconductor package includes a protective material, a substrate, bumps, and a semiconductor chip. The bumps are provided on a chip plane of the semiconductor chip and are connected to the substrate via wires. The semiconductor chip is laminated on the substrate. A support is provided on the chip plane to support the protective material at a position where the height from the chip plane of the semiconductor chip is higher than the bumps.