Semiconductor Package Crack Preventing Layer for Thermal Stress
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Solution Overview
Problem
Semiconductor packages face reliability issues due to thermal stress at contact points between dissimilar materials, particularly at the interface of redistribution layers and passivation films, leading to potential cracks and reliability degradations.
Innovation Solution
A semiconductor package design incorporating a support frame with a cavity, a semiconductor chip with insulating films and a conductive crack preventing layer, and a connection member with an insulating layer and redistribution layer, where the conductive crack preventing layer extends to the outer peripheral region of the second insulating film to mitigate stress and crack propagation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a redistribution layer and passivation film contact structure is used to achieve device compactness, then device lightness and slimness are improved, but thermal stress concentration occurs at contact points leading to crack formation and reliability degradation
Solution Approach 1:
A crack preventing layer is introduced as an intermediary component between the redistribution layer and passivation film. This layer acts as a stress buffer that absorbs thermal expansion differences and prevents crack propagation, thereby maintaining package reliability while preserving the compact design structure.
Solution Approach 2:
The patent employs a composite structure consisting of multiple layers with different material properties (redistribution layer, crack preventing layer, passivation film). Each layer is designed with specific mechanical and thermal characteristics that, when combined, create a composite structure resistant to thermal stress while maintaining compact dimensions.
2Adaptability or versatility
If dissimilar materials are used in the package structure to achieve functional requirements, then device functionality is improved, but thermal stress concentration at material interfaces causes cracks and reliability issues
Solution Approach 1:
The crack preventing layer serves as a mediator between dissimilar materials with different thermal expansion coefficients. It accommodates the thermal stress generated at material interfaces due to temperature changes, preventing stress concentration from causing cracks while allowing the package to maintain its functional multi-material structure.
Solution Approach 2:
The patent modifies the mechanical and thermal parameters of the package structure by introducing a layer with intermediate properties between dissimilar materials. This changes the stress distribution parameters and thermal expansion characteristics, reducing harmful stress concentrations at interfaces while preserving the functional benefits of using different materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces the degradation of reliability due to thermal stress, enhancing the package's durability and preventing crack propagation, thereby improving the overall reliability of the semiconductor package.
Implementation Method 1
thermal stress may occur intensively at contact points between dissimilar materials
Implementation Method 2
a conductive crack preventing layer disposed on the connection region and having an outer peripheral region extending to a portion of the second insulating film around the first opening
Data Source
AI summary
A semiconductor package includes a support frame, and including a cavity, a semiconductor chip disposed in the cavity and having an active surface on which contact pads are arranged, and a connection member on the support frame and on the active surface of the semiconductor chip. The semiconductor chip includes a first insulating film disposed on the active surface and exposing the contact pads, a second insulating film disposed on the first insulating film and including a first opening exposing connection regions of the contact pads, and a conductive crack preventing layer disposed on the connection regions and having an outer peripheral region extending to a portion of the second insulating film around the first opening. The connection member includes an insulating layer including a second opening exposing the connection regions; and a redistribution layer connected to the contact pads through the second opening.