Semiconductor Package Redistribution Layout for Crosstalk Isolation
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Solution Overview
Problem
Current semiconductor packages face challenges in reliability and durability due to signal interference and crosstalk between redistribution patterns, which affect the integration and electrical characteristics of semiconductor modules.
Innovation Solution
A semiconductor package design featuring a redistribution substrate with a photosensitive dielectric layer and strategically spaced signal redistribution patterns, which are electrically isolated from ground and power redistribution patterns, reducing interference and enhancing integration and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If redistribution patterns are placed closer together to increase integration, then device complexity is reduced and space is saved, but signal interference and crosstalk between patterns increase
Solution Approach 1:
A photosensitive dielectric layer is introduced as an intermediary between the semiconductor chip and the redistribution patterns. This layer provides enhanced insulation and spacing control, allowing patterns to be placed closer together while maintaining electrical isolation and reducing crosstalk, thus enabling higher integration density without compromising signal integrity.
Solution Approach 2:
The patent modifies the dielectric properties by introducing a photosensitive dielectric layer with specific permittivity characteristics. This parameter change allows for reduced spacing between redistribution patterns while maintaining acceptable signal interference levels, thereby increasing integration density without sacrificing reliability.
2Reliability
If vertical distance between chip pad and signal redistribution pattern is increased to reduce interference, then signal integrity improves, but package height increases
Solution Approach 1:
The patent changes the dielectric parameters by using a photosensitive dielectric layer with optimized permittivity and thickness characteristics. This allows reduction of the vertical distance between chip pad and signal redistribution pattern while maintaining signal integrity through enhanced dielectric isolation properties.
Solution Approach 2:
The patent employs a composite structure combining the semiconductor chip, photosensitive dielectric layer, and redistribution patterns. This composite approach enables compact vertical integration while maintaining signal integrity through the synergistic properties of the different materials and their interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design increases the reliability and compactness of semiconductor packages by minimizing signal interference and impedance differences, leading to improved electrical characteristics and high integration of semiconductor modules.
Implementation Method 1
a photosensitive dielectric layer between the semiconductor chip and the redistribution pattern
Data Source
AI summary
Disclosed is a semiconductor package including a semiconductor chip that includes a chip pad on one surface of the semiconductor chip, a redistribution pattern on the one surface of the semiconductor chip and electrically connected to the chip pad, and a photosensitive dielectric layer between the semiconductor chip and the redistribution pattern. The photosensitive dielectric layer may be in physical contact with the redistribution pattern. The redistribution pattern includes a signal redistribution pattern, a ground redistribution pattern, and a power redistribution pattern. A vertical distance between the chip pad and the signal redistribution pattern may be greater than a width of the signal redistribution pattern.