Semiconductor Package Coating Layout to Prevent Cutting Cracks
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Solution Overview
Problem
Stress during the cutting process of semiconductor packaging can cause cracks, reducing the strength of the semiconductor.
Innovation Solution
A semiconductor package design featuring a chip region surrounded by a substrate with a recessed surrounding region and a coating film that covers and overlaps the edge parts, inhibiting residue movement and crack formation during cutting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the semiconductor is cut for packaging, then the semiconductor can be packaged and distributed, but stress occurs in the cut area causing cracks that reduce the strength of the semiconductor
Solution Approach 1:
A recess part is formed in the surrounding region before the cutting process. This preliminary structural modification creates a stress-relief zone that prevents crack propagation during subsequent cutting operations, thereby maintaining semiconductor strength while enabling efficient packaging
Solution Approach 2:
A coating film is applied as an intermediary layer that covers the recess part and extends over the chip region. This coating film acts as a protective mediator during cutting, distributing stress and preventing direct contact between the cutting tool and vulnerable areas, thus preventing cracks while allowing the cutting process to proceed
2Reliability
If a coating film covers the entire substrate including the surrounding region, then the semiconductor is protected, but the cutting process becomes difficult and residues remain
Solution Approach 1:
The coating film is segmented into different regions: it covers the chip region and part of the surrounding region, but deliberately exposes the recess part. This segmentation allows the coating to protect vulnerable areas while leaving the cutting zone accessible, eliminating residues and facilitating easier cutting operations
Solution Approach 2:
The coating film is applied with different coverage in different regions. The chip region receives full coating coverage for maximum protection, while the surrounding region has partial coverage with the recess part exposed. This local differentiation optimizes both protection and manufacturability by applying coating only where necessary
Data Source
AI summary
A method of fabricating a semiconductor package includes providing a substrate that includes a chip region including a semiconductor device and a surrounding region that at least partially surrounds the chip region, forming a recess part that extends from a first side of the chip region into the surrounding region, forming a coating film that at least partially overlaps the chip region and the surrounding region in a first direction that is perpendicular to an upper surface of the substrate, where the coating film exposes a portion of the recess part, and cutting the portion of the recess part exposed by the coating film.