3D Semiconductor Package Interconnects for Shorter Data Paths
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Solution Overview
Problem
The increasing demand for high data transmission speed in edge computing, high performance computing, and automotive intelligence computing poses challenges in integrating more components within semiconductor packages, as existing technologies struggle to efficiently connect multiple electronic components without compromising data transmission rates.
Innovation Solution
A semiconductor package structure that includes a carrier, multiple electronic components, and a connection element which electrically connects these components without passing through the substrate, providing a direct and efficient data transmission path between stacked components, thereby reducing transmission length and enhancing data rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If more electronic components are integrated in a semiconductor package to fulfill demand for increased data transmission speed, then data transmission capability is improved, but device complexity and integration difficulty increase
Solution Approach 1:
The patent transitions from traditional planar component arrangement to a three-dimensional stacked architecture. Multiple electronic components are vertically stacked and interconnected through connection elements that extend between different elevation levels, enabling increased component density and data transmission capability without proportionally increasing planar footprint or integration complexity.
2Area of stationary object
If electronic components are stacked vertically to increase integration density, then area utilization is improved, but connection complexity and transmission path length increase
Solution Approach 1:
Connection elements serve as intermediary structures that directly bridge electronic components at different elevation levels. These connection elements provide optimized transmission paths that are shorter than traditional substrate-routed paths, as they establish direct electrical connections between stacked components without requiring signals to traverse the substrate plane.
3Speed
If connection elements directly connect stacked electronic components without passing through substrate, then data transmission speed is improved, but manufacturing precision requirements increase
Solution Approach 1:
The connection system is segmented into multiple independent connection elements, each responsible for connecting specific pairs of components at different elevation levels. This segmentation allows for modular manufacturing and assembly, where each connection element can be precisely positioned and connected independently, reducing the cumulative precision requirements compared to a single monolithic connection structure.
Data Source
AI summary
A semiconductor package structure is provided. The semiconductor package structure includes a carrier, a first electronic component, a second electronic component, a third electronic component, a fourth electronic component, and a connection element. The first electronic component is disposed over a surface of the carrier. The second electronic component is disposed over the first electronic component. The third electronic component is spaced apart from the first electronic component and disposed over the surface of the carrier. The fourth electronic component is disposed over the third electronic component. The connection element is electrically connecting the second electronic component to the fourth electronic component.