Semiconductor Package Structure for Reliable Wafer-Level Debonding
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Solution Overview
Problem
The reliability of electrical connections between conductive terminals and internal components in semiconductor packages is a challenge due to variations in thermal expansion coefficients and the need for efficient manufacturing processes that ensure stable adhesion and debonding in wafer-level packaging.
Innovation Solution
A method involving a debond layer, buffer layer, and redistribution circuit structure with conductive pillars and insulating encapsulation is used to create a stable and reliable electrical connection, with the debond layer enabling room temperature debonding and the buffer layer ensuring coplanarity, while the redistribution circuit structure provides routing functions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wafer-level packaging is used, then manufacturing efficiency is maintained, but electrical connection reliability deteriorates due to thermal expansion variations
Solution Approach 1:
A debond layer is introduced as an intermediary between the carrier and the semiconductor wafer. This debond layer has a thermal expansion coefficient that matches the semiconductor wafer, thereby mediating the thermal stress during bonding and improving electrical connection reliability. The debond layer acts as a buffer that absorbs thermal expansion mismatches between different materials in the package structure.
2Reliability
If strong adhesion is used to ensure stable connection, then connection reliability improves, but debonding difficulty increases in wafer-level packaging
Solution Approach 1:
The debond layer exhibits dynamic adhesion characteristics: it provides strong adhesion during the bonding process to ensure stable electrical connections, but allows easy debonding when needed for wafer-level packaging operations. The layer's adhesive properties can be controlled to change from strong (during bonding) to weak (during debonding), enabling both reliable connection and easy separation at different manufacturing stages.
3Reliability
If complex packaging structures are used to improve electrical connection, then connection reliability improves, but manufacturing cost increases
Solution Approach 1:
Instead of making the entire package structure complex, the solution applies local quality enhancement by introducing the debond layer only at specific critical interfaces where thermal expansion mismatch occurs. This localized approach improves electrical connection reliability at the bonding interface without requiring complex structures throughout the entire package, thereby controlling manufacturing costs while achieving the desired reliability improvement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of electrical connections, reduces manufacturing costs, and improves the thermal stability of semiconductor packages by ensuring consistent adhesion and debonding, thereby increasing yield and performance.
Implementation Method 1
the debond layer enabling room temperature debonding
Implementation Method 2
the buffer layer ensuring coplanarity
Implementation Method 3
redistribution circuit structure with conductive pillars
Data Source
AI summary
A package structure includes a semiconductor die, a redistribution circuit structure, and conductive pads. The redistribution circuit structure is located on and electrically connected to the semiconductor die, the redistribution circuit structure includes a first contact pad having a first width and a second contact pad having a second width. The conductive pads are located on and electrically connected to the redistribution circuit structure through connecting to the first contact pad and the second contact pad, the redistribution circuit structure is located between the conductive pads and the semiconductor die. The first width of the first contact pad is less than a width of the conductive pads, and the second width of the second contact pad is substantially equal to or greater than the width of the conductive pads.