Semiconductor Package Die-Specific Data Encoding
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Solution Overview
Problem
Existing semiconductor packages rely on expensive and unreliable non-volatile elements like fuses or anti-fuses to store die-specific parameters, which are crucial for optimizing operations such as current, voltage, and resistance, but these methods are costly and prone to errors.
Innovation Solution
Incorporating machine-readable codes, such as one-dimensional and two-dimensional barcodes, onto the semiconductor package to store and convey die-specific information, allowing for secure and efficient retrieval of parameters like voltage ranges, trimming parameters, and redundancy addresses, using an indication reader and controller to access this data.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If non-volatile elements like fuses or anti-fuses are used to store die-specific parameters, then the parameters can be stored reliably, but the cost increases and reliability decreases
Solution Approach 1:
The patent uses machine-readable codes (barcodes, data matrices) as external copies of die-specific parameter information, replacing the need for physical non-volatile storage elements on the die. This copying approach eliminates the cost and reliability issues associated with fuses and anti-fuses while maintaining accurate parameter storage and retrieval
Solution Approach 2:
The patent introduces an intermediary system consisting of machine-readable codes on the package and an indication reader that interfaces between the die parameters and the programming system. This intermediary allows non-contact reading of parameters and eliminates the need for direct electrical connection to fragile fuse/anti-fuse elements
2Ease of manufacture
If machine-readable codes are used to store die-specific information, then cost decreases and accessibility improves, but new system complexity is introduced
Solution Approach 1:
The machine-readable code system serves multiple functions: storing die-specific parameters, providing cost-effective implementation, enabling non-contact reading, and supporting various code formats (barcodes, data matrices). This multi-functionality justifies the added system complexity by consolidating multiple benefits into a single approach
3Reliability
If die-specific parameters are stored externally on the package, then reliability and cost-effectiveness improve, but information security challenges arise
Solution Approach 1:
The patent implements a feedback mechanism where the indication reader reads the machine-readable code, the system determines whether the parameters match an authorized code, and only then allows programming. This feedback loop provides security verification while maintaining the benefits of external parameter storage
Data Source
AI summary
Semiconductor device packages and associated methods are disclosed herein. In some embodiments, the semiconductor device package includes (1) a first surface and a second surface opposite the first surface; (2) a semiconductor die positioned between the first and second surfaces; and (3) an indication positioned in a designated area of the first surface. The indication includes a code presenting information for operating the semiconductor die. The code is configured to be read by an indication scanner coupled to a controller.