Semiconductor Package Redistribution Layer for Dense Die Interconnects
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Solution Overview
Problem
The semiconductor industry faces challenges in creating smaller and more efficient packaging techniques for semiconductor dies as demand for miniaturization increases, necessitating improved connection integrity and additional signal communication paths.
Innovation Solution
A semiconductor package design featuring a redistribution layer between first and second semiconductor dies, allowing for additional signal communication paths through horizontal and vertical connections, facilitated by a redistribution layer and through insulator vias.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional packaging techniques are used, then device size can be reduced, but connection integrity and signal communication paths are insufficient
Solution Approach 1:
The patent introduces a redistribution layer that creates additional signal communication paths in the vertical dimension (between first and second semiconductor dies) and horizontal dimension (within the redistribution layer), transforming the traditional single-plane connection into a multi-dimensional interconnection structure that enhances connection integrity while maintaining compact device volume
Solution Approach 2:
The patent segments the signal transmission path into multiple independent routes through the redistribution layer and through-insulator vias, allowing signals to travel through different paths (direct vertical connections, horizontal redistribution paths, and combined routes), which improves connection reliability by providing redundant communication channels
2Ease of manufacture
If traditional packaging techniques are used, then manufacturing process remains simple, but additional signal communication paths are not achieved
Solution Approach 1:
The redistribution layer serves multiple functions simultaneously: it redistributes electrical signals to create additional communication paths, provides mechanical support between dies, enables both vertical and horizontal signal routing, and facilitates heat dissipation, thereby achieving enhanced signal communication capabilities without proportionally increasing manufacturing complexity
Data Source
AI summary
A semiconductor package includes a plurality of first semiconductor dies, a first bonding layer, a redistribution layer, a plurality of second semiconductor dies and a plurality of conductive terminals. The first bonding layer is disposed on the first semiconductor dies, and includes a plurality of first bonding pads. The redistribution layer is disposed on and electrically connected to the first bonding pads. The second semiconductor dies are disposed on and electrically connected to the redistribution layer, wherein backside surfaces of the second semiconductor dies are facing active surfaces of the first semiconductor dies. The conductive terminals are disposed on and electrically connected to the second semiconductor dies.