Semiconductor Package Structure for Crack-Resistant Die Pad Bonding
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Solution Overview
Problem
Existing semiconductor devices face challenges in achieving higher performance and quality, particularly in the package structure, which affects the reliability and stability of the device.
Innovation Solution
The semiconductor device incorporates a die pad with specific portions (first, second, third, and fourth portions) and leads that are designed to overlap with a resin member, providing a stable and secure package structure that enhances the bonding process and reduces the risk of deformation or cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor device uses a conventional package structure, then the device can be manufactured with standard processes, but the device performance and quality are limited
Solution Approach 1:
The die pad is divided into multiple portions (first die pad portion, second die pad portion, third die pad portion) with different thicknesses and functions. The first portion has greater thickness for mechanical support, while the second and third portions have reduced thickness to reduce stress concentration and prevent cracking during bonding operations.
Solution Approach 2:
Different portions of the die pad are designed with different local properties: the first die pad portion has greater thickness for structural integrity, while the second and third portions have reduced thickness at their respective ends to minimize stress during bonding. The resin member is also configured with specific thickness variations to match the die pad portions.
2Productivity
If the leads are arranged around the die pad, then the device achieves high-density surface mounting, but the bonding process may cause deformation or cracking
Solution Approach 1:
The resin member is positioned and configured beforehand to cover and protect the leads during the bonding process. The resin member's thickness is specifically designed to match the die pad portions, providing cushioning and stress distribution during bonding operations to prevent deformation or cracking of the leads and die pad structure.
3Ease of manufacture
If the die pad has uniform thickness, then the manufacturing process is simplified, but stress concentration may occur during bonding causing cracking
Solution Approach 1:
The die pad is segmented into multiple portions with different thicknesses tailored to their specific functional requirements. This segmentation allows each portion to be optimized for its role while maintaining overall structural integrity and reducing stress concentration points during bonding operations.
Solution Approach 2:
The die pad exhibits local quality variations where different portions have different thicknesses: the first portion has greater thickness for support, while the second and third portions have reduced thickness at their ends to prevent stress concentration and cracking during bonding, despite the increased manufacturing complexity.
Data Source
AI summary
A semiconductor device, includes: a semiconductor element having element main surface and element back surface spaced apart from each other in thickness direction and including a plurality of main surface electrodes arranged on the element main surface; a die pad having a die pad main surface where the semiconductor element is mounted; a plurality of leads including at least one first lead arranged on one side in first direction orthogonal to the thickness direction with respect to the die pad, and arranged around the die pad when viewed in the thickness direction; a plurality of connecting members including a first connecting member bonded to the at least one first lead, and configured to electrically connect the main surface electrodes and the leads; and a resin member configured to seal the semiconductor element, a part of the die pad, parts of the leads, and the connecting members.