Semiconductor Package Rework for Cross-Platform Die Reuse
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Solution Overview
Problem
Returned semiconductor package structures cannot be reused on platforms of other clients due to unique packaging types, leading to significant losses when they are not compatible with other clients' packaging systems.
Innovation Solution
A method to transform initial semiconductor package structures by removing the initial substrate to obtain a die package device, designing a new substrate, and electrically connecting the die package device with the package substrate, allowing the package structure to be adapted for use on different platforms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If returned semiconductor package structures are scrapped due to unique packaging types and incompatibility with other clients' platforms, then loss of substance is minimized (no valuable components wasted), but loss of value increases significantly (entire batch becomes worthless)
Solution Approach 1:
The patent segments the semiconductor package structure into distinct components: the substrate (initial substrate) and the die package device (containing the die device and initial package layer). By separating these components, the valuable die package device can be extracted and reused on different platforms, while only the incompatible substrate is discarded. This segmentation transforms a previously all-or-nothing situation into a selective reuse scenario, minimizing both substance loss and value loss.
Solution Approach 2:
The patent applies the discarding and recovering principle by deliberately discarding only the initial substrate that causes compatibility issues, while recovering and reusing the die package device on a new package substrate. This selective discarding approach ensures that valuable components are not wasted (minimizing loss of substance) while enabling continued utility of the recovered components (minimizing loss of value).
2Adaptability or versatility
If returned semiconductor package structures are scrapped rather than reused, then adaptability to different platforms is not compromised, but productivity is reduced due to loss of reusable components
Solution Approach 1:
By segmenting the package structure into substrate and die package device, the patent enables the die package device to be adapted to different package substrates for different clients' platforms. This segmentation removes the adaptability constraint that previously existed when the entire package had to be scrapped, thereby maintaining adaptability while enabling reuse that boosts productivity.
Solution Approach 2:
The selective discarding of only the incompatible substrate while recovering the die package device allows the recovered component to be deployed on multiple different platforms. This approach maintains adaptability across different clients' platforms while significantly improving productivity by avoiding complete scrapping of the batch.
3Adaptability or versatility
If the initial substrate is removed to enable reuse of die package devices, then adaptability to different platforms is improved, but device complexity increases due to additional processing steps
Solution Approach 1:
The segmentation of the package structure into substrate and die package device creates a modular system where the die package device becomes a reusable component. While this segmentation requires additional processing steps (removing initial substrate, forming new connections), it dramatically improves adaptability by allowing the same die package device to be mounted on different package substrates for different clients' platforms.
Solution Approach 2:
The new package substrate acts as an intermediary between the die package device and the client's platform. This intermediary approach allows the die package device to be decoupled from its original substrate-specific constraints, enabling it to interface with different platforms through the standardized new package substrate, thereby improving adaptability despite the additional processing required.
Data Source
AI summary
The present disclosure provides a semiconductor package structure, a fabricating method thereof, and a memory system. The fabricating method comprises: providing an initial semiconductor package structure comprising: an initial substrate, a die device on the initial substrate and electrically connected with the initial substrate, and an initial package layer on the initial substrate and covers the die device; removing the initial substrate to obtain a die package device including the die device and at least a portion of the initial package layer; attaching a package substrate on the die device and electrically connecting the die device with the package substrate; and forming a first package layer on the package substrate to cover the die package device.