Semiconductor Package Layout for Compact Dielectric Isolation
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Solution Overview
Problem
Semiconductor devices face challenges in achieving compactness without compromising dielectric strength, particularly due to the proximity of wires to the insulating element during resin sealing, which can reduce the device's insulation effectiveness.
Innovation Solution
The semiconductor device incorporates a conductive support member with specifically designed pad portions and edges to optimize the placement of the control and driver elements and insulating elements, ensuring effective sealing resin flow and distribution, thereby maintaining dielectric strength while achieving a compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the semiconductor device is made more compact by reducing the volume of sealing resin, then the device size is reduced, but the dielectric strength between the control element and driver element is lowered
Solution Approach 1:
The invention transitions from planar arrangement to three-dimensional stacked arrangement of pad portions. The first pad portion is positioned at a first position in the thickness direction, while the second pad portion is positioned at a second position in the thickness direction, separated by the insulating element. This vertical stacking reduces the horizontal footprint and allows compact device design while maintaining adequate insulation distance through the thickness direction.
Solution Approach 2:
The insulating element is introduced as an intermediary component between the first pad portion (control element side) and the second pad portion (driver element side). This insulating element physically separates the high-voltage and low-voltage sections, ensuring adequate dielectric strength even when the overall device size is reduced. The insulating element acts as a mediator that enables compact design without compromising insulation reliability.
2Ease of manufacture
If wires are pushed closer to the insulating element by resin flow during manufacturing, then the sealing process is simplified, but the dielectric strength is reduced
Solution Approach 1:
The insulating element is pre-positioned between the first pad portion and the second pad portion before the sealing resin injection process. This preliminary arrangement ensures that even when resin flow pushes wires toward the insulating element during manufacturing, the insulating element maintains its position and continues to provide adequate dielectric strength. The insulating element is already in place to prevent harmful effects before they can occur.
Solution Approach 2:
The insulating element serves as a protective intermediary that shields the high-voltage driver element section from the resin flow and wire displacement effects. By positioning the insulating element between the pad portions, it creates a stable insulation barrier that is not easily compromised by manufacturing variations in resin injection or wire placement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures that the semiconductor device can be made more compact without lowering its dielectric strength, as the sealing resin effectively fills the gaps between the elements, preventing voids and maintaining insulation integrity.
Implementation Method 1
The insulating element enables transmission of electric signals between the control element and the driver element that are electrically insulated from each other, so that the control element is protected from a relatively high voltage
Implementation Method 2
One of the coils converts an electric signal transmitted from the control element into magnetic force. The other coil converts the magnetic force into an electric signal of a greater potential difference than the electric signal transmitted from the control element
Data Source
AI summary
A semiconductor device includes a conductive support member, a control element, an insulating element, a driver element and a sealing resin. The conductive support member includes a first lead and a second lead. The first lead has a first pad portion. The second lead has a second pad portion. The second pad portion is adjacent to the first pad portion in a first direction perpendicular to a thickness direction of the first pad portion. The control element is mounted on the first pad portion. The insulating element is mounted on the first pad portion and electrically connected to the control element. The driver element is mounted on the second pad portion and electrically connected to the insulating element. The sealing resin covers the first pad portion, the second pad portion, the control element, the insulating element and the driver element. As viewed in the thickness direction, the first pad portion has a first edge adjacent to the second pad portion in the first direction and extending in a second direction perpendicular to the thickness direction and the first direction. The first edge has a first end and a second end opposite in the second direction. As viewed in the thickness direction, the second pad portion has a second edge adjacent to the first edge in the first direction and extending in the second direction. The second edge has a third end and a fourth end opposite in the second direction. One of the third end and the fourth end is located between the first end and the second end in the second direction.