Semiconductor Package With Direct-Bonded-Metal Substrate for Thermal Management
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Solution Overview
Problem
Thermal interface materials (TIMs) increase thermal resistance between semiconductor devices and external heat transfer mechanisms, leading to excessive heating and reduced reliability, while also increasing manufacturing costs.
Innovation Solution
A semiconductor device package design featuring a die attach paddle and a direct-bonded-metal substrate with a ceramic layer that electrically isolates the external thermal dissipation surface, eliminating the need for TIMs and reducing thermal resistance by allowing direct heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thermal interface material (TIM) is used to provide electrical isolation between the external heat transfer mechanism and the thermal dissipation surface, then electrical isolation is achieved, but thermal resistance increases
Solution Approach 1:
The patent introduces a ceramic layer as an intermediary substance between the first metal layer (connected to semiconductor device) and the second metal layer (external thermal dissipation surface). This ceramic intermediary provides electrical isolation while maintaining thermal conduction, thereby resolving the contradiction between achieving electrical isolation and minimizing thermal resistance.
2Reliability
If a thermal interface material (TIM) is used to provide electrical isolation, then electrical isolation is achieved, but manufacturing costs increase
Solution Approach 1:
The ceramic layer serves as a cost-effective intermediary that integrates electrical isolation functionality directly into the package structure. This eliminates the need for separate TIM materials and associated manufacturing operations, thereby reducing manufacturing costs while maintaining electrical isolation.
3Temperature
If direct heat transfer is enabled by eliminating TIM, then thermal resistance decreases, but electrical isolation may be compromised
Solution Approach 1:
The patent employs a composite structure consisting of a ceramic layer bonded to metal layers (forming a DBM substrate). This composite material combination leverages the electrical insulation properties of ceramics while maintaining thermal conduction capabilities, enabling direct heat transfer without compromising electrical isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces thermal resistance, enhances semiconductor device reliability, and lowers manufacturing costs by eliminating the need for TIMs and associated manufacturing operations.
Implementation Method 1
The second metal layer can be electrically isolated from the first metal layer by the ceramic layer
Implementation Method 2
reducing thermal resistance by allowing direct heat transfer
Data Source
AI summary
In one general aspect, a semiconductor device package can include a die attach paddle having a first surface and a second surface that is opposite the first surface. The package can also include a semiconductor die coupled with the first surface of the die attach paddle. The package can further include a direct-bonded-metal (DBM) substrate. The DBM substrate can include a ceramic layer having a first surface and a second surface that is opposite the first surface; a first metal layer disposed on the first surface of the ceramic layer and coupled with the second surface of the die attach paddle; and a second metal layer disposed on the second surface of the ceramic layer. The second metal layer can be exposed external to the semiconductor device package. The second metal layer can be electrically isolated from the first metal layer by the ceramic layer.