Semiconductor Package with Direct Die Contacts
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Solution Overview
Problem
Conventional semiconductor packages experience signal strength loss and interference due to signals traveling through substrates, which are prone to thermal noise and parasitic inductance and capacitance.
Innovation Solution
A semiconductor packaging solution that includes a thermally conductive layer with a substrate and semiconductor die affixed using adhesive layers, an encapsulating layer covering the components, and exposing electrical contacts to directly connect the semiconductor die to the outside environment, reducing signal path length and thermal impairments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If signals travel through the substrate to connect the semiconductor die to the outside environment, then electrical connections are established, but signal strength is lost and thermal interference occurs
Solution Approach 1:
The patent divides the electrical connection path into two segments: (1) direct electrical contacts that extend from the semiconductor die through the substrate to the outside environment, and (2) substrate electrical traces that remain isolated from the signal path. This segmentation allows the signal to travel only through the low-impedance direct contacts while the substrate provides mechanical support and power delivery through separate paths, eliminating thermal noise and parasitic effects from the signal path.
Solution Approach 2:
The patent introduces an intermediary structure consisting of direct electrical contacts that mediate between the semiconductor die and the outside environment. These contacts serve as a dedicated low-impedance pathway that bypasses the substrate's electrical traces for signal transmission, while the substrate continues to provide mechanical support and electrical connections for power and ground through its trace network.
2Strength
If the entire bottom of the semiconductor package is the substrate, then mechanical support is provided, but signal path length increases causing signal strength loss
Solution Approach 1:
The patent segments the electrical connection function from the mechanical support function. Direct electrical contacts provide short-length signal paths through the substrate thickness, while the substrate itself provides mechanical support and hosts isolated electrical traces for power and ground connections. This segmentation enables the substrate to fulfill its mechanical role without contributing to signal path length.
Solution Approach 2:
The patent transitions the signal connection from a planar two-dimensional path through substrate traces to a three-dimensional vertical path through direct electrical contacts that penetrate the substrate thickness. This dimensional change dramatically shortens the signal path length while the substrate maintains its mechanical support function in the horizontal plane.
3Adaptability or versatility
If electrical connections are embedded throughout the substrate, then comprehensive electrical connectivity is achieved, but thermal noise and parasitic inductance increase
Solution Approach 1:
The patent segments electrical connections into two distinct types: (1) direct electrical contacts that provide low-impedance signal paths with minimal parasitic effects, and (2) substrate electrical traces that provide comprehensive connectivity for power, ground, and control signals. This segmentation allows the substrate to maintain versatile electrical connectivity while isolating signal paths from sources of thermal noise and parasitic effects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances signal reliability by reducing signal path length and minimizing thermal interference, while also providing effective heat dissipation and mechanical support.
Implementation Method 1
A semiconductor package, including a thermally conductive layer used to dissipate heat from the semiconductor package
Data Source
AI summary
A semiconductor package is formed having a substrate juxtaposed on at least two sides of a semiconductor die. Both the substrate and the semiconductor die are affixed to a conductive layer that draws heat generated during use of the semiconductor package away from the semiconductor die and the substrate. There are also electrical contacts affixed to the substrate and the semiconductor die. The electrical contacts facilitate electrical connection between the semiconductor die, the substrate, and any external devices or components making use of the semiconductor die. The substrate, semiconductor die, and at least a portion of some of the electrical contacts are enclosed by an encapsulating layer insulating the components. Portions of the electrical contacts not enclosed by the encapsulating layer are affixed to an outside device, such as a printed circuit board.