Semiconductor Package Direct Lead Frame Joining
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Solution Overview
Problem
In transfer-molded power modules, insufficient creepage distance between the spacer and power device leads to low insulation performance, and the spacer is damaged under high temperature conditions, reducing reliability, while existing high-voltage driving units have limitations on communication speed and require costly new lead frames for multi-chip configurations.
Innovation Solution
A semiconductor package with a built-in insulated driver in a multi-chip configuration is directly joined to the lead frame, eliminating the need for spacers and allowing the use of existing lead frames, thereby improving insulation performance and reliability while reducing costs and enhancing mountability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a spacer is used to support the built-in package, then the package structure is maintained, but insulation performance lowers due to insufficient creepage distance and reliability lowers due to spacer damage under high temperature conditions
Solution Approach 1:
The invention extracts and removes the spacer component from the package structure. By directly joining the built-in package to the lead frame, the spacer is eliminated entirely, thereby eliminating the insulation problems and reliability issues associated with spacers while maintaining structural integrity through direct mounting
2Ease of manufacture
If an insulated driver with multi-chip configuration is mounted on an existing lead frame, then cost saving and mountability are improved, but the communication speed and malfunction prevention are limited compared to using a new dedicated lead frame
Solution Approach 1:
The invention makes the existing lead frame universal by enabling it to accommodate the multi-chip insulated driver configuration without requiring a dedicated new lead frame design. The direct joining method allows the same lead frame to serve multiple functions and configurations, achieving cost savings while maintaining adequate communication performance for the application
3Ease of manufacture
If the built-in package is directly joined to the lead frame, then cost saving is achieved by using existing lead frames and mountability is improved, but the creepage distance may be insufficient without spacer support
Solution Approach 1:
The invention removes the spacer component entirely and directly joins the built-in package to the lead frame. This extraction of the intermediate spacer element reduces manufacturing complexity and cost while the direct joining method establishes adequate creepage distance through proper design of the joining structure and package layout
Solution Approach 2:
The invention merges the built-in package directly with the lead frame by eliminating the spacer interface. This consolidation reduces the number of components and assembly steps, achieving cost savings while maintaining insulation performance through optimized direct coupling design
Data Source
AI summary
A semiconductor package includes: a semiconductor device; a lead frame; a built-in package including an insulated driver having a multi-chip configuration and driving the semiconductor device; a wire connecting the built-in package to the semiconductor device; and a resin sealing the semiconductor device, the lead frame, the built-in package, and the wire, wherein the built-in package is directly joined to the lead frame.