Semiconductor Package Connector Layout for Direct Pad Attachment
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Solution Overview
Problem
Conventional semiconductor packages face issues such as excess cost, poor thermal performance, decreased reliability, and large package sizes, with inadequate manufacturing methods leading to inefficiencies and increased complexity.
Innovation Solution
A method for forming semiconductor packages that includes a conductive connector with a plate portion and connective portions directly attached to a substrate, utilizing conductive linking portions to maintain alignment and provide a current path for plating, reducing the need for intervening leads or lands, thereby enhancing alignment and connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional semiconductor packages use traditional leadframe structures with multiple leads and lands, then connectivity is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The conductive connector is segmented into distinct functional portions: a plate portion for attachment to the semiconductor device, connective portions for direct connection to the substrate, and conductive linking portions for maintaining alignment. This segmentation eliminates the need for traditional leads and lands while maintaining connectivity reliability.
Solution Approach 2:
The conductive connector integrates multiple functions into a single component: it provides electrical connectivity, maintains alignment between layers, and serves as a structural support element. This multi-functionality reduces the overall number of components needed in the package structure.
2Ease of manufacture
If conventional packages use multiple intervening leads and lands for connectivity, then electrical connection is established, but manufacturing cost and production time increase
Solution Approach 1:
Multiple traditional components (leads, lands, and connection elements) are merged into a single integrated conductive connector. This consolidation reduces the quantity of conductive elements from multiple separate pieces to one unified component, simplifying assembly and reducing manufacturing steps.
Solution Approach 2:
The conductive connector is pre-configured with integrated alignment features and conductive pathways before assembly. The conductive linking portions are pre-formed to maintain proper alignment, eliminating the need for complex alignment procedures during manufacturing.
3Area of stationary object
If traditional leadframe structures are used with multiple connection points, then connectivity is achieved, but package size increases
Solution Approach 1:
The conductive connector transitions from a planar two-dimensional leadframe structure to a three-dimensional configuration with vertical connective portions extending from the plate portion. This dimensional change allows direct connection to substrate contact pads without requiring extensive lateral routing, reducing the package footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in reduced costs, improved yields, and increased reliability of packaged electronic devices by simplifying assembly processes and ensuring proper alignment and connectivity without the need for additional leads or lands.
Implementation Method 1
The conductive linking portions are configured to provide a connected and conductive current path for a plating process used to provide a conductive solder layer on exposed portions of the package electronic device during the assembly process
Data Source
AI summary
A method for forming packaged electronic devices includes providing a substrate having pads connected by conductive pad linking portions and semiconductor devices attached to the pads in different orientations. A second substrate is provided having conductive connectors each with a plate portion, a conductive member extending from a side segment of the plate portion, a connective portion extending from the conductive member distal to the plate portion, and conductive linking portions physically connecting adjoining plate portions together. Each plate portion is attached to one of the semiconductor devices to provide a subassembly. A package body is provided to encapsulate at least portions of the subassembly. The method includes separating the encapsulated subassembly to provide the packaged electronic devices such that the separating step severs the conductive linking portions.