Semiconductor Package Disk for Stress Distribution
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Solution Overview
Problem
Semiconductor packages face issues with compressive stress, shear forces, and temperature influences during the molding process, which can interfere with electrical parameters and lead to undesirable shifts in sensitive integrated circuits.
Innovation Solution
A disk with higher flexural rigidity than the molding compound is placed on the semiconductor body to distribute point loads and absorb molding heat, while an adhesive layer secures it and provides electrical insulation, using materials with similar coefficients of expansion to minimize stress on the integrated circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor body is enclosed with molding compound during the molding process, then the semiconductor package is protected and sealed, but compressive stress and shear forces are applied to the integrated circuit causing undesirable shifts in electrical parameters
Solution Approach 1:
A disk made of molding compound with higher flexural rigidity is introduced as an intermediary element between the molding compound and the integrated circuit. This disk absorbs and distributes the compressive stress and shear forces generated during the molding process, preventing these harmful forces from being directly transmitted to the sensitive integrated circuit while still allowing the molding compound to provide protection and sealing.
Solution Approach 2:
The disk is positioned specifically over the integrated circuit area where stress concentration occurs during molding. By placing this reinforcement element only where needed (locally), the patent protects the vulnerable integrated circuit from compressive stress and shear forces without requiring the entire package structure to be modified, thus maintaining overall reliability while eliminating localized harmful effects.
2Object-affected harmful factors
If a disk with higher flexural rigidity is placed on the semiconductor body to distribute point loads, then the integrated circuit is protected against excessive point loads, but the device structure becomes more complex
Solution Approach 1:
The disk is made from the same molding compound material used for the package encapsulation. By merging the disk material with the existing molding compound material, the patent reduces device complexity - the disk and the package housing are essentially made from the same material system, simplifying manufacturing and reducing the number of different materials that need to be managed in the structure.
Solution Approach 2:
The disk is designed with specific dimensional parameters (larger base area than the integrated circuit, specific thickness) that give it higher flexural rigidity compared to the surrounding molding compound. By carefully controlling these geometric parameters, the disk achieves the necessary mechanical protection function while maintaining compatibility with the overall molding process and material system.
3Manufacturing precision
If the disk encloses the integrated circuit, then the electrical parameters remain stable under stress, but the manufacturing process requires additional steps to position and secure the disk
Solution Approach 1:
The disk is positioned and secured on the semiconductor body before the final molding process. This preliminary action ensures the disk is in the correct position to protect the integrated circuit from the outset, allowing the subsequent molding process to proceed without additional complex positioning steps. The adhesive layer is applied in advance to secure the disk prior to molding.
Solution Approach 2:
An adhesive layer is introduced as an intermediary between the disk and the semiconductor body to secure the disk in position. This adhesive mediator simplifies the manufacturing process by providing a reliable bonding method that is compatible with existing assembly techniques, making it easier to position and secure the disk without requiring complex mechanical fixation methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the sensitivity of semiconductor packages to pressure, temperature, and shear forces, maintaining stable electrical parameters and increasing production yield by acting as a buffer and reducing parameter drift due to environmental influences.
Implementation Method 1
the flexural rigidity of the disk exceeds the flexural rigidity of the surrounding molding compound in order to distribute the compressive stress point load on the top area of the disk across the surface of the semiconductor body
Implementation Method 2
the disk is electrically insulated from the semiconductor body and the pins
Implementation Method 3
the disk with the base area partially covers the integrated circuit on the top face of the semiconductor
Data Source
AI summary
In one embodiment, a semiconductor package comprising a metal base coupled to one or more pins, a semiconductor body having a top side and a bottom side, the top side comprising an integrated circuit and one or more metal surfaces for coupling the integrated circuit to the one more pins with one or more bonding wires, the bottom side non-positively coupled to the metal base, a disk having a top area and a base area, the base area coupled to the top side of the semiconductor body and at least partially covering the integrated circuit, the disk being electrically insulated from the semiconductor body, and a plastic compound completely enclosing the one or more bonding wires, and at least partially enclosing the top side of the integrated circuit, the top area of the disk, and the one or more pins.