Semiconductor Package With Embedded Driver Modules
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Solution Overview
Problem
In electronic systems, converter circuits with semiconductor power switches and driver chips face challenges in minimizing space on printed circuit boards (PCBs) while reducing switching losses and parasitic inductances, which are not effectively addressed by existing assembly methods.
Innovation Solution
A semiconductor package design that integrates semiconductor transistor and driver modules with encapsulating materials and external connectors, where the semiconductor driver chips are embedded in a separate encapsulation layer connected to the transistor chips via metallic areas and via connections, reducing interconnections and enhancing thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If semiconductor components are mounted as individual components on a printed circuit board, then ease of manufacture and assembly is improved, but space on the PCB increases and interconnection lengths increase leading to higher switching losses and parasitic inductances
Solution Approach 1:
The patent combines multiple semiconductor components (transistor module, driver module, passive components) into a single integrated semiconductor package. The transistor module and driver module are mounted on the same PCB substrate within the package, with direct interconnections between them, eliminating the need for separate component mounting and reducing overall PCB space occupation while minimizing interconnection lengths.
2Loss of energy
If semiconductor components are integrated with short interconnections, then switching losses and parasitic inductances are reduced, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent segments the semiconductor package into distinct functional modules (transistor module, driver module, passive component module) that are mounted on the PCB substrate. Each module maintains its functional independence while being integrated within the same package, allowing for optimized interconnections with short lengths to reduce switching losses and parasitic inductances, while the modular structure manages complexity.
3Loss of energy
If semiconductor components are integrated with short interconnections, then parasitic inductances are reduced, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent segments the semiconductor package into distinct functional modules (transistor module, driver module, passive component module) that are mounted on the PCB substrate. Each module maintains its functional independence while being integrated within the same package, allowing for optimized interconnections with short lengths to reduce switching losses and parasitic inductances, while the modular structure manages complexity.
4Temperature
If separate encapsulation layers are used for transistor and driver modules, then thermal management and electrical isolation are improved, but manufacturing steps increase
Solution Approach 1:
The patent applies separate encapsulation layers (first encapsulation layer for transistor module, second encapsulation layer for driver module) to provide thermal management and electrical isolation. The method integrates these encapsulation steps into the overall manufacturing process, where the PCB substrate serves as the common mounting platform, and encapsulation is applied to specific regions, managing the manufacturing complexity through systematic process integration.
Data Source
AI summary
A semiconductor package includes a mold body having a first main face, a second main face opposite to the first main face and side faces connecting the first and second main faces, a first semiconductor module including a plurality of first semiconductor chips and a first encapsulation layer disposed above the first semiconductor chips, and a second semiconductor module disposed above the first semiconductor module. The second semiconductor module includes a plurality of second semiconductor channels and a second encapsulation layer disposed above the second semiconductor channels. The semiconductor package further includes a plurality of external connectors extending through one or more of the side faces of the mold body.