Semiconductor Package Marking With Laser-Melted Dry Film
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Solution Overview
Problem
The challenge is to create a method for marking semiconductor packages that does not require etching the molding layer, thereby maintaining the package's thickness and reliability while allowing for identification and storage capacity information.
Innovation Solution
A method involving the use of a dry film attached to a carrier substrate, where laser light is applied to liquefy and form an ink marking pattern on the semiconductor package's molding layer without etching, allowing for the inclusion of information such as storage capacity or producer identification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If etching is performed on the molding layer to form markings, then identification information can be displayed, but the package thickness increases and reliability decreases
Solution Approach 1:
A dry film is introduced as an intermediary layer on top of the molding layer. The marking is formed on this dry film through laser irradiation rather than etching the molding layer itself. This mediator allows identification information to be displayed while preserving the original thickness and integrity of the molding layer and package structure.
Solution Approach 2:
The marking formation process is segmented into distinct steps: attaching a dry film to the molding layer, selectively removing portions of the dry film through laser irradiation to form markings, and then removing the remaining dry film. This segmentation allows the marking function to be separated from the structural molding layer, avoiding thickness increase.
2Loss of information
If etching is performed on the molding layer to form markings, then identification information can be displayed, but the package reliability decreases
Solution Approach 1:
The dry film serves as a sacrificial intermediary that protects the molding layer from direct etching damage. The laser removes material from the dry film to create markings, while the molding layer remains intact and undamaged, preserving package reliability.
Solution Approach 2:
The dry film is a temporary, disposable layer used solely for marking formation. It is attached, processed, and then completely removed after the markings are transferred to the molding layer. This disposable approach avoids permanent modification or damage to the critical molding layer structure.
3Length of stationary object
If a dry film is attached and processed to form markings without etching, then package thickness is maintained, but additional process steps are required
Solution Approach 1:
The marking formation process extracts the etching operation from the molding layer and relocates it to the dry film. By taking out the harmful etching action and applying it only to the removable dry film, the process achieves markings without compromising the molding layer or increasing package thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the formation of clear and durable ink marking patterns on semiconductor packages without compromising the package's thickness or reliability, effectively addressing the need for identification and information display.
Implementation Method 1
forming an ink spot radiating laser light to the carrier substrate such that a portion of the dry film is liquified
Implementation Method 2
a portion of the dry film is liquified
Implementation Method 3
forming an ink marking pattern by solidifying the ink spot corresponding to the liquefied portion of the dry film
Data Source
AI summary
A method of marking a semiconductor package includes preparing a semiconductor package including a semiconductor chip and a package molding layer surrounding semiconductor chip, attaching a dry film to a top surface of the package molding layer, the dry film being attached to a carrier substrate, forming an ink spot by liquefying a portion of the dry film by radiating laser light to the carrier substrate, forming an ink marking pattern by solidifying the ink spot corresponding to the liquefied portion of the dry film, and removing a remaining portion of the dry film from the top surface of the package molding layer, the remaining portion of the dry film having not been liquefied, wherein the ink marking pattern includes information about storage capacity or information for identifying a producer of a product.