Semiconductor Package Dual Cooling System Through-Electrode Heat Dissipation
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in efficiently dissipating heat generated by stacked chips without increasing manufacturing processes, costs, or damaging the chips, especially when using microchannels for cooling.
Innovation Solution
The semiconductor package incorporates a dual cooling system with first and second cooling units, where the first cooling unit surrounds the through-electrodes and the second cooling unit is formed on the chip surface, connected via sealing members, allowing for effective heat dissipation without the need for microchannels, thus reducing manufacturing complexity and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If microchannels are formed in semiconductor chips for heat dissipation, then heat dissipation efficiency is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The cooling part extends from the lower surface through the thickness of the semiconductor chip to the upper surface, utilizing the vertical dimension to conduct heat away from the chip interior without requiring horizontal microchannels within the chip structure itself
Solution Approach 2:
The cooling system is divided into separate components: a cooling part attached to the lower surface and a heat dissipation part on the upper surface, allowing independent optimization of each component without modifying the chip's internal structure
2Temperature
If microchannels are formed in semiconductor chips for heat dissipation, then heat dissipation efficiency is improved, but manufacturing time increases
Solution Approach 1:
The cooling part is prepared and attached to the lower surface of the semiconductor chip before final packaging, allowing heat dissipation structure installation to occur at an optimal stage in the manufacturing process without adding post-chip steps
3Temperature
If microchannels are formed in semiconductor chips for heat dissipation, then heat dissipation efficiency is improved, but chip strength deteriorates
Solution Approach 1:
The heat dissipation function is extracted from the semiconductor chip structure itself and implemented as a separate cooling part attached to the chip's lower surface, preserving the chip's structural integrity while providing effective cooling
Solution Approach 2:
The cooling part acts as an intermediary between the heat-generating chip and the external environment, transferring heat from the chip's lower surface through thermal conduction without requiring any modifications to the chip's internal structure
4Reliability
If through-electrodes are used to stack semiconductor chips, then electrical connection between chips is improved, but heat generation increases
Solution Approach 1:
The cooling part is positioned to surround the through-electrodes and is electrically connected to them, combining the electrical connection function with the heat dissipation function in a single integrated structure
Solution Approach 2:
The cooling part serves multiple functions simultaneously: it provides thermal conduction away from the chip, acts as an electrical connection path through the through-electrodes, and serves as a mounting structure for attaching the chip to the substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat dissipation from both the through-electrodes and the semiconductor chips, minimizing manufacturing processes and costs while maintaining chip strength, and improving heat dissipation characteristics compared to conventional methods.
Implementation Method 1
a cooling part formed in the semiconductor chip and on the upper surface of the semiconductor chip
Implementation Method 2
connected via sealing members
Data Source
AI summary
A semiconductor package comprises a semiconductor chip, through electrodes and cooling parts. The semiconductor chip has bonding pads on an upper surface thereof. The through-electrodes are formed in the semiconductor chip. The cooling parts are formed in the semiconductor chip and on the upper surface of the semiconductor chip in order to dissipate heat.