Semiconductor Package With Dual-Roughness Insulation Layer
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Solution Overview
Problem
Semiconductor packaging technologies face challenges in achieving miniaturization and stability while preventing moisture and foreign particle intrusion, often resulting in increased package thickness and adhesion instability.
Innovation Solution
A semiconductor package design featuring substrates with distinct surface roughness regions, where the first surface portion has a lower roughness than the second surface portion, and a passivation layer is used to fill the gap between the semiconductor chip and the substrate, preventing underfill resin flow and enhancing adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor mounting techniques such as stacking several semiconductor chips on a single substrate or stacking one package on another package are used, then high functionality and high response rate are achieved, but the total thickness of the final package increases
Solution Approach 1:
The insulating layer is formed with different surface roughness in different regions: a first region with first surface roughness and a second region with second surface roughness different from the first. This local differentiation allows the package to achieve miniaturization while maintaining stable adhesion and preventing moisture penetration, resolving the contradiction between high functionality and reduced package thickness
2Productivity
If conventional semiconductor mounting techniques are used, then high functionality is achieved, but adhesion stability is limited
Solution Approach 1:
Different regions of the insulating layer are given different surface roughness characteristics. The first region has a surface roughness that provides stable adhesion, while the second region has different surface roughness that prevents moisture penetration. This local quality differentiation simultaneously achieves both adhesion stability and moisture protection, resolving the contradiction between high functionality and adhesion stability
3Reliability
If techniques are used to prevent moisture and foreign particles from penetrating into the semiconductor package, then reliability is improved, but device complexity increases due to additional dam structures
Solution Approach 1:
The insulating layer is designed with different surface roughness in different regions to inherently prevent moisture and foreign particle penetration. The second region's surface roughness acts as a barrier that prevents underfill resin and moisture from entering, eliminating the need for additional dam structures. This approach maintains reliability while reducing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces package size, enhances stability, and prevents moisture and contamination, eliminating the need for dam structures and allowing for efficient formation of a passivation layer that protects against external factors.
Implementation Method 1
a first surface portion at a first region and a second surface portion at a second region, and the first surface portion has a surface roughness which is different from a surface roughness of the second surface portion
Data Source
AI summary
A semiconductor package includes a substrate having an insulation layer. The insulation layer has a first region having a first surface roughness and a second region having a second surface roughness. A semiconductor chip is mounted in the first region, and an underfill resin solution is filled into the space between the semiconductor chip and the insulation layer. The roughness of the second region prevents the underfill resin from flowing out from the semiconductor chip to thereby reduce a size of the semiconductor package.