Semiconductor Package Layout With Dummy Heat Path for Compact Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
There is a need for semiconductor packages that offer improved thermal radiation efficiency and increased operating reliability, while also reducing the size and weight of electronic components.
Innovation Solution
The semiconductor package includes a package substrate with a core section, redistribution layers, a dummy structure with higher thermal conductance than the redistribution layers, and a bridge chip, which enhances heat transfer efficiency through central and peripheral through vias.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple semiconductor chips are integrated into a single package to reduce size and weight, then the compactness is improved, but the thermal radiation efficiency deteriorates
Solution Approach 1:
The package substrate is divided into a core section and a heat dissipation section, with through vias segmented into central and peripheral groups. This segmentation allows heat to be distributed and dissipated through multiple pathways, improving thermal radiation efficiency while maintaining the compact integrated package structure.
Solution Approach 2:
Different regions of the package substrate are assigned different functions: the core section contains through vias for electrical connection and heat dissipation, while the heat dissipation section contains the dummy structure with high thermal conductance. This local quality differentiation optimizes both thermal management and electrical performance within the compact package.
2Volume of moving object
If multiple semiconductor chips are integrated into a single package to reduce size and weight, then the compactness is improved, but the operating reliability deteriorates
Solution Approach 1:
The through vias are divided into central and peripheral groups, creating multiple independent heat dissipation pathways. This segmentation ensures that heat generated by multiple chips can be effectively managed, preventing thermal runaway and improving operating reliability while maintaining package compactness.
Solution Approach 2:
The dummy structure acts as an intermediary heat dissipation component in the heat dissipation section. It receives heat from the core section through the peripheral through vias and dissipates it efficiently, serving as a thermal mediator that protects the integrated chips and improves overall operating reliability.
3Temperature
If a dummy structure with high thermal conductance is added to improve heat transfer, then the thermal radiation efficiency is improved, but the device complexity increases
Solution Approach 1:
The dummy structure in the heat dissipation section serves multiple functions: it acts as a heat sink, provides mechanical support, and fills empty space in the package. This multi-functionality improves thermal conductance without proportionally increasing device complexity, as the same structure performs multiple roles.
Solution Approach 2:
The thermal conductance parameter is optimized by adjusting the dimensions and material properties of the dummy structure. By changing these parameters, high thermal conductance is achieved while keeping the structural complexity manageable through systematic design optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves thermal radiation efficiency and operating reliability by effectively transferring heat from the bridge chip and other components through the dummy structure and through vias, while also enhancing electrical properties.
Implementation Method 1
a thermal conductance of the dummy structure is greater than a thermal conductance of the first redistribution layer
Implementation Method 2
a thermal conductance of each of the plurality of central through vias is greater than a thermal conductance of each of the plurality of peripheral through vias
Implementation Method 3
a thermal conductance of the bridge chip is greater than a thermal conductance of the second redistribution layer
Data Source
AI summary
A semiconductor package includes a package substrate, a first device on the package substrate and a second device on the package substrate and horizontally spaced apart from the first device, where the package substrate includes a first redistribution layer, a second redistribution layer on the first redistribution layer, a core section between the first redistribution layer and the second redistribution layer, a dummy structure in the first redistribution layer and on a bottom surface of the core section and a bridge chip in the second redistribution layer and on a top surface of the core section, and where a thermal conductance of the dummy structure is greater than a thermal conductance of the first redistribution layer.