Semiconductor Package Dummy Structure Layout for Heat and Warpage
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in reducing size and weight while improving warpage, heat-dissipation, and electrical characteristics, especially in stack-type semiconductor packages, where integrating multiple components in a single package is essential for high-performance, compact electronic devices.
Innovation Solution
The proposed semiconductor package includes a substrate with a chip stack and dummy structures, where the first dummy structure is positioned on the side of a semiconductor chip and the second dummy structure is on the upper surface, both made of high thermal conductivity materials like bulk silicon, to enhance heat dissipation and structural stability, and an under-fill layer is used to connect these structures to the substrate, improving thermal conductivity and mechanical robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple semiconductor chips are integrated in a single package to reduce size, then the package size is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent transitions from horizontal arrangement of chips to vertical stacking arrangement, utilizing the third dimension (height) to integrate multiple chips. This dimensional change allows compact packaging while maintaining heat dissipation paths through the vertical structure, with heat sinking elements positioned at the bottom to conduct heat away from the stacked chips.
Solution Approach 2:
The patent introduces intermediary thermal management components including thermal interface materials between chips and heat sinking elements at the bottom of the package. These intermediaries facilitate efficient heat transfer from the densely packed chips to the external environment, resolving the heat dissipation challenge created by compact integration.
2Stability of the object's composition
If dummy structures are added to improve structural stability, then warpage is reduced, but device complexity increases
Solution Approach 1:
The dummy structures serve multiple functions simultaneously: they act as structural fillers to prevent warpage, provide thermal management support, and maintain mechanical stability. By combining multiple functions into single components, the patent reduces overall device complexity while achieving structural stability.
Solution Approach 2:
The dummy structures are made from materials with similar thermal and mechanical properties to the semiconductor chips, creating a homogeneous package structure. This homogeneity ensures uniform stress distribution and thermal conduction, improving stability without requiring complex heterogeneous material integration.
3Temperature
If high thermal conductivity materials are used for dummy structures, then heat dissipation is improved, but manufacturing cost increases
Solution Approach 1:
Instead of using high thermal conductivity materials throughout the entire package, the patent applies thermal management materials selectively in critical heat flow paths. The dummy structures and thermal interface materials are positioned specifically where heat dissipation is most needed, achieving effective thermal management while minimizing the use of expensive materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly enhances heat-dissipation efficiency and structural stability, reducing the risk of warpage and fabrication failures, thereby enabling the creation of compact, high-performance semiconductor packages with improved reliability.
Implementation Method 1
an under-fill layer filling a space between the second semiconductor chip and the interposer substrate and between the first dummy structure and the interposer substrate
Implementation Method 2
a first dummy structure provided on one of the second side surface of the second semiconductor chip and the third side surface of the second semiconductor chip, and an under-fill layer filling a space between the second semiconductor chip and the interposer substrate... The first dummy structure may include bulk silicon
Data Source
AI summary
A semiconductor package may include a substrate, a chip structure mounted on the substrate, and a first dummy structure attached to the chip structure. The chip structure may include a first semiconductor chip, a second dummy structure disposed at a side of the first semiconductor chip, and a mold layer enclosing the first semiconductor chip and the second dummy structure. A bottom surface of the first semiconductor chip, a bottom surface of the second dummy structure, and a bottom surface of the mold layer may be coplanar with each other.