Semiconductor Package Heat Dissipation Through Dummy Pattern Structures
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Solution Overview
Problem
Semiconductor packages face challenges in effectively dissipating heat generated by semiconductor dies, leading to thermal stress and reduced operating efficiency due to limited heat dissipation at the bottom of the die and within the substrate.
Innovation Solution
Incorporating dummy pattern structures and a heat dissipation structure that are thermally interconnected with a dam structure, allowing heat to be dissipated in six directions - upward, lateral, and downward - through the semiconductor package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the semiconductor die becomes smaller and thinner to meet industry demands, then device integration and functionality are improved, but heat generation per unit volume increases
Solution Approach 1:
The invention addresses the heat generation problem in miniaturized devices by implementing three-dimensional heat dissipation structures including dummy pattern structures embedded within the substrate and protrusions extending to the bottom surface. This multi-directional approach increases the effective heat dissipation surface area without increasing the footprint of the semiconductor die, allowing efficient heat management in compact form factors.
Solution Approach 2:
The dummy pattern structures serve multiple functions: they act as heat dissipation pathways, provide mechanical support, and enable thermal coupling between the semiconductor die and the substrate. This multi-functionality allows the same structural elements to address both the space constraints of miniaturization and the heat management challenges arising from increased power density.
2Reliability
If heat is not released from the semiconductor package, then thermal stress and warpage occur, but adding heat dissipation structures increases device complexity
Solution Approach 1:
The invention merges the heat dissipation function with existing substrate structures by integrating dummy pattern structures into the substrate and using the substrate itself as a heat dissipation pathway. This merging approach eliminates the need for separate, complex heat dissipation components while still achieving effective thermal management and preventing warpage through controlled heat distribution.
Solution Approach 2:
The substrate is designed to serve dual functions: as the mechanical support structure and as an active heat dissipation pathway through the dummy pattern structures. This multi-functionality reduces overall device complexity by eliminating the need for dedicated heat dissipation components while still achieving effective thermal management and warpage prevention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal characteristics by maximizing heat dissipation area and improving heat management, thereby maintaining operating efficiency and reliability of semiconductor packages.
Implementation Method 1
the semiconductor die, the dummy pattern structures, and the heat dissipation structure are thermally interconnected
Implementation Method 2
heat generated in the semiconductor die to dissipate to the top of the semiconductor package
Data Source
AI summary
A semiconductor package may include a substrate including a substrate base and a plurality of dummy pattern structures penetrating the substrate base in a vertical direction, a semiconductor die on the substrate, and a heat dissipation structure on the substrate and surrounding at least a portion of the semiconductor die, where the heat dissipation structure is connected to the plurality of dummy pattern structures.