Semiconductor Package 3D Modeling via Dynamic Stack Objects
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Solution Overview
Problem
Current methods for modeling semiconductor packages, especially those with complex structures and multiple components, fail to accurately represent the physical relationships between components, leading to inadequate electrical and thermal performance modeling.
Innovation Solution
The implementation of a dynamic stack methodology that uses a root object and flexible reference objects to specify the Z, X, and Y coordinates of each component relative to one another, allowing for accurate representation and modeling of semiconductor packages with complex structures, including bond wires, clips, and other electrical connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional modeling methods are used for semiconductor packages, then the modeling process is simple, but the accuracy of physical relationships between components is insufficient
Solution Approach 1:
The semiconductor package is divided into multiple discrete objects, each representing a specific component (die, leadframe, substrate, etc.). Each object is assigned unique identification and spatial coordinates, allowing precise representation of individual component positions and relationships without requiring complex overall modeling.
Solution Approach 2:
The patent transitions from two-dimensional layout representations to three-dimensional spatial modeling by introducing Z-coordinates in addition to X and Y coordinates. This enables accurate representation of vertical stacking relationships, layer positions, and depth-based physical connections between components.
2Reliability
If complex structures with multiple components are modeled, then the electrical and thermal performance accuracy improves, but the modeling complexity increases
Solution Approach 1:
A universal object file format is created that can represent multiple component types (semiconductor dies, leadframes, substrates, encapsulants) using a common data structure. Each object type follows the same formatting rules with standardized fields for identification, geometry, material properties, and spatial coordinates, simplifying the modeling of complex multi-component systems.
Solution Approach 2:
The object file serves as an intermediary data structure between the physical semiconductor package and the computational models. It translates complex physical relationships into standardized digital representations that can be processed by simulation software, enabling accurate electrical and thermal analysis without directly modeling every physical detail.
3Manufacturing precision
If precise coordinate relationships are established for all objects, then the three-dimensional model accuracy improves, but the data processing time increases
Solution Approach 1:
All spatial coordinates, object relationships, and physical properties are predetermined and encoded in the object file during the design phase. This preliminary establishment of precise geometric relationships allows simulation software to directly import and use the data without requiring complex real-time calculations or iterative positioning during analysis.
Solution Approach 2:
The physical semiconductor package is replicated in digital space through the object file, which contains complete geometric and spatial information. This digital copy preserves all coordinate relationships and physical dimensions, enabling accurate virtual modeling and analysis without repeatedly measuring or calculating from physical prototypes.
Data Source
AI summary
Implementations of an object file for modeling using a three dimensional modeling module may include a first object defined as a root object, the first object corresponding with a first component of a semiconductor package; a second object corresponding with a second component of the semiconductor package directly physically coupled to the first component of the semiconductor package, the second object including a reference to the root object; and at least a third object corresponding with a third component of the semiconductor package, the third object including a reference to the root object, the third component of the semiconductor package directly coupled with a fourth component of the semiconductor package indirectly physically coupled to the second component of the semiconductor package.